Metal-Clad Laminate Roughness Control for Strong Foil Bonding

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Solution Overview

Problem

Existing methods struggle to increase the thickness of the insulating layer in metal-clad laminates without causing a decline in the peel strength of the metal foil, which affects the stability and performance of printed wiring boards.

Innovation Solution

A manufacturing method involving the continuous feeding of metal foils and insulating films between endless belts, followed by hot-press molding, where the insulating films have surfaces with controlled roughness differences to enhance adhesion and thickness, resulting in an insulating layer with a thickness of 100-300 μm and peel strength of 0.60 N/mm or more.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the thickness of the insulating layer is increased to reduce transmission losses, then the RF characteristics are improved, but the peel strength of the metal foil with respect to the insulating layer deteriorates

Engineering Contradiction:
Improvetransmission lossVSAvoidpeel strength
Core Design Contradiction:
Loss of energyVSStrength

Solution Approach 1:

The patent applies local quality by creating asymmetric surface roughness on the insulating films - one surface has higher roughness (Rz≥1.5μm) to enhance metal foil adhesion, while the other surface has lower roughness (Rz≤3.0μm) to ensure proper bonding with adjacent insulating layers. This localized differentiation of surface properties allows the thick insulating layer (100-300μm) to maintain both low transmission loss and high peel strength (≥0.60N/mm)

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent utilizes parameter changes by precisely controlling the ten-point mean roughness (Rz) values of the insulating film surfaces within specific ranges. By adjusting the surface roughness parameters of different faces of the insulating films and ensuring the absolute difference between contacting surfaces is ≤0.35μm, the patent achieves optimal balance between transmission loss reduction (through increased thickness) and peel strength maintenance

Inventive Principle:
Principle #35Parameter changes

2Loss of energy

If multiple insulating films are stacked to increase insulating layer thickness, then transmission loss is reduced, but the manufacturing complexity and control of surface roughness uniformity increase

Engineering Contradiction:
Improvetransmission lossVSAvoidmanufacturing process complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the thick insulating layer into multiple individual insulating films (each with thickness L/2 to 5L/6 where L is total thickness). These segmented films are stacked and hot-press molded together, with each film having controlled surface roughness on both faces. This segmentation approach enables achieving the desired total thickness (100-300μm) for low transmission loss while managing manufacturing complexity through standardized film units

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent manages manufacturing complexity through parameter changes by establishing specific roughness control criteria: each insulating film's first surface has Rz≥1.5μm, the second surface has Rz≤3.0μm, and the absolute difference between surfaces of adjacent films is ≤0.35μm. These quantified parameters provide clear manufacturing guidance, transforming the complex multi-film stacking process into a controllable procedure that ensures both performance and consistency

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method allows for increased thickness of the insulating layer, reducing transmission losses and maintaining high peel strength, thereby enhancing the stability and performance of printed wiring boards.

Implementation Method 1

hot-press molding the first sheet of metal foil, the plurality of insulating films, and the second sheet of metal foil together to form an insulating layer out of the plurality of insulating films

Methodology Applied
Scientific EffectHot-press molding: Heating

Implementation Method 2

The resin layers each contain a liquid crystal polymer. A peel strength of the sheet of metal foil with respect to the insulating layer is equal to or greater than 0.60 N/mm

Methodology Applied
Scientific EffectDielectric properties: Dielectric

Data Source

PatentUS20250303673A1Method for manufacturing metal-clad laminate, and metal-clad laminate
Publication Date: 2025.10.02 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US20250303673A1 patent drawing
  • US20250303673A1 patent drawing
  • US20250303673A1 patent drawing

AI summary

A manufacturing method includes stacking, between two endless belts, a first sheet of metal foil, a plurality of insulating films, and a second sheet of metal foil in this order one on top of another and hot-press molding these sheets and films together to form an insulating layer out of the plurality of insulating films. Each of the plurality of insulating films has a first surface and a second surface. The second surface has a larger ten-point mean roughness (Rzjis) than the first surface. The absolute value of difference between a ten-point mean roughness (Rzjis) of a surface, in contact with the first sheet of metal foil, of the insulating layer and a ten-point mean roughness (Rzjis) of another surface, in contact with the second sheet of metal foil, of the insulating layer is equal to or less than 0.35 μm.