Metal Coating via Intermittent Current and Solid Electrolyte Membrane
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Solution Overview
Problem
Existing methods for forming metal coatings, such as electroless plating and PVD, face challenges including the need for washing processes, internal stress in coatings, and limitations in thickness and pattern precision, particularly with the use of solid electrolyte membranes where metal ions can diffuse and deposit undesirably outside the intended coating region.
Innovation Solution
A method involving a solid electrolyte membrane between an anode and substrate, where a current is intermittently flowed to suppress deposition on non-coating regions, allowing for a desired pattern shape and increased coating thickness by alternating current-flowing and non-current-flowing periods, and using a pulse current waveform to enhance ion replenishment and coating quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a current is continuously flowed during coating formation using a solid electrolyte membrane, then metal coating can be formed on the substrate, but metal ions diffuse radially and deposit on non-coating regions, reducing manufacturing precision
Solution Approach 1:
The patent applies periodic action by alternating between current-flowing periods (for metal deposition) and non-current-flowing periods (for ion replenishment and diffusion suppression). This periodic current application prevents continuous radial diffusion of metal ions to non-coating regions while maintaining adequate coating formation rate, thereby improving pattern shape accuracy without sacrificing productivity
2Quantity of substance
If the thickness of metal coating is increased using PVD method, then more material is deposited, but internal stress is generated in the coating
Solution Approach 1:
The patent changes the fundamental parameter of deposition mechanism from physical vapor deposition to electrochemical deposition. By using electrochemical deposition with controlled current flow and periodic interruption, the method can form thicker coatings without the internal stress problems inherent in PVD methods, as the electrochemical process allows for more controlled material incorporation and stress management
3Ease of manufacture
If electroless plating is used to form metal coating, then coating can be formed on substrate, but washing process and waste liquid treatment are required
Solution Approach 1:
The patent replaces the chemical-based electroless plating process with an electrochemical deposition process using a solid electrolyte membrane. This substitution eliminates the need for washing processes and waste liquid treatment while maintaining coating formation capability, as the solid membrane contains and directs metal ions to the coating region without requiring liquid waste management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of metal coatings with a desired pattern shape and dense, fine crystal structure, improving the coating-forming rate and reducing the incorporation of impurities, while maintaining a high-quality metal coating.
Implementation Method 1
a solid electrolyte membrane 63 that is disposed between the anode 61 and a substrate B, which forms a cathode, such that a solution L containing metal ions is in contact with a portion of the solid electrolyte membrane 63 on the anode 61 side
Implementation Method 2
causing, in a state where the solid electrolyte membrane is in contact with the substrate B, a current to flow from the anode 61 to the cathode (substrate B) so that metal is deposited on a surface of the substrate B from metal ions contained in the solid electrolyte membrane 63
Implementation Method 3
an anode 61 that is formed of a porous body; a solid electrolyte membrane 63 that is disposed between the anode 61 and a substrate B
Data Source
AI summary
A method of forming a metal coating includes: disposing a solid electrolyte membrane (13) between an anode (11) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane (13); and causing, in a state where the solid electrolyte membrane (13) is in contact with the substrate (B), a current to flow from the anode (11) to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode (11) to the cathode and a non-current-flowing period (N) in which a current does not flow between the anode (11) and the cathode.