Metal Foil Electronic Assembly for Low-Cost EMI Shielding
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Solution Overview
Problem
Existing methods for blocking electromagnetic waves, particularly magnetic fields, require special materials and methods that are costly and time-consuming.
Innovation Solution
An electronic assembly design featuring a circuit board with semiconductor integrated circuits enclosed by a cover layer, solder bumps, a metal foil layer with cut portions, and a metal coating layer that extends across edges to physically and electrically connect with ground connectors, minimizing cost while maximizing electromagnetic wave blocking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If special materials with high magnetic permeability are used to block magnetic fields, then electromagnetic wave blocking performance is improved, but fabrication cost increases
Solution Approach 1:
The patent changes the configuration parameters of standard metal foil layers and cover layers to achieve effective electromagnetic shielding. By optimizing the extent to which these layers cover the circuit board and electronic components, the patent achieves blocking performance without requiring expensive special magnetic materials.
Solution Approach 2:
The patent creates a composite shielding structure combining metal foil layers, cover layers, and metal coating layers. This composite approach using conventional materials achieves superior electromagnetic wave blocking performance compared to using single special magnetic materials, thereby reducing fabrication costs.
2Object-affected harmful factors
If special methods are used to block magnetic fields, then electromagnetic wave blocking performance is improved, but processing time increases
Solution Approach 1:
The patent merges the electromagnetic shielding function with existing structural components (metal foil layers and cover layers) that are already part of the electronic assembly. By combining multiple functions into unified structures, the patent achieves effective shielding without requiring separate special processing steps, thereby reducing processing time.
Solution Approach 2:
The metal foil layers and cover layers serve multiple functions: they provide structural support, electrical connection, and electromagnetic wave blocking. This multi-functionality eliminates the need for separate special processing steps dedicated solely to shielding, thus reducing overall processing time.
3Object-affected harmful factors
If metal coating layer is extended to contact metal foil layer across edges, then electromagnetic wave blocking performance is improved, but device complexity increases
Solution Approach 1:
The patent extends the metal coating layer from the upper surface across the edges to contact the metal foil layer on the lower surface, utilizing the third dimension (depth/thickness) to create continuous shielding. This dimensional approach achieves complete electromagnetic wave blocking without requiring complex multi-component assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively blocks electromagnetic waves while reducing fabrication costs and processing time.
Implementation Method 1
a first metal foil layer including a cut portion to expose the solder bump, and bonded to the second main surface of the circuit board; and a metal coating layer which is conformally coated over an upper surface of the electronic assembly on the first main surface of the circuit board, and is extended toward the second main surface of the circuit board across edges of the electronic assembly in order to physically, electrically contact the metal foil layer
Data Source
AI summary
The present disclosure relates to an electronic assembly. Specifically, according to an embodiment of the present disclosure, there is provided an electronic assembly including: a circuit board including a plurality of electric conductive connectors; a plurality of spaced semiconductor integrated circuits coupled to a first main surface of the circuit board; a cover layer disposed on the semiconductor integrated circuit to substantially enclose and to cover the semiconductor integrated circuit; a plurality of solder bumps disposed on a second main surface facing the first main surface of the circuit board in order to provide an electric connection to the electronic assembly; a first metal foil layer comprising a cut portion to expose the solder bump, and bonded to the second main surface of the circuit board; and a metal coating layer which is conformally coated over an upper surface of the electronic assembly on the first main surface of the circuit board, and is extended toward the second main surface of the circuit board across edges of the electronic assembly in order to physically, electrically contact the metal foil layer, and to coat side surfaces of the electronic assembly.