Metal Pattern Formation via Light-Activated Electroless Plating

Solution Overview

Problem

The existing methods for forming signal lines in liquid crystal display (LCD) panels face challenges such as signal delay due to long gate and data lines, difficulty in controlling metal properties like aluminum and copper, high manufacturing costs, and environmental concerns due to multiple masking and vacuum deposition processes, which also limit precision and fine pattern formation.

Innovation Solution

A method involving the formation of a metal pattern through a precursor layer on a substrate, followed by light irradiation to create a metal seed layer, and subsequent electroless-plating to form a metal pattern layer, simplifying the process by combining exposure and annealing steps and allowing for uniform distribution and increased thickness of the metal pattern, enabling the formation of signal lines with low resistance and high aspect ratio.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple masking and vacuum deposition processes are used to form signal lines, then the signal line can be formed with controlled metal properties, but the manufacturing cost increases and the process complexity increases

Engineering Contradiction:

Improvemetal property controlVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate processes (masking, vacuum deposition, etching, washing) into a single electroless plating process. The metal pattern is formed directly on the substrate using electroless plating, eliminating the need for multiple sequential steps and reducing overall process complexity while maintaining control over metal properties

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces mechanical vacuum deposition processes with a chemical electroless plating process. Instead of physically depositing metal vapor in vacuum, the metal is deposited chemically through electroless plating, simplifying the equipment requirements and process steps

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If multiple masking and vacuum deposition processes are used to form signal lines, then the signal line can be formed with controlled metal properties, but the manufacturing cost increases

Engineering Contradiction:

Improvemetal property controlVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple separate processes (masking, vacuum deposition, etching, washing) into a single electroless plating process. The metal pattern is formed directly on the substrate using electroless plating, eliminating the need for multiple sequential steps and reducing overall process complexity while maintaining control over metal properties

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces mechanical vacuum deposition processes with a chemical electroless plating process. Instead of physically depositing metal vapor in vacuum, the metal is deposited chemically through electroless plating, simplifying the equipment requirements and process steps

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If multiple masking and vacuum deposition processes are used to form signal lines, then the signal line can be formed, but the precision deteriorates and fine pattern formation becomes difficult

Engineering Contradiction:

Improvesignal line precisionVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces mechanical vacuum deposition processes with a chemical electroless plating process. Instead of physically depositing metal vapor in vacuum, the metal is deposited chemically through electroless plating, which provides more uniform and precise pattern formation without the limitations of mechanical deposition

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Productivity

If conventional signal line formation processes are used, then the process can be completed, but noxious substances are discharged

Engineering Contradiction:

Improveprocess completionVSAvoidnoxious substance discharge

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces mechanical vacuum deposition processes with a chemical electroless plating process. Instead of physically depositing metal vapor in vacuum, the metal is deposited chemically through electroless plating, which eliminates the need for vacuum equipment and reduces harmful emissions

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the metal pattern formation process, achieves uniform distribution on large areas, reduces manufacturing costs, and enables the creation of signal lines with small electric resistance and fast response, addressing the limitations of existing technologies.

Implementation Method 1

irradiating a light on the precursor layer to form a metal seed layer having a predetermined pattern

Methodology Applied

Scientific EffectPhoto-induced reduction: Photodissociation

Implementation Method 2

electroless-plating the metal seed layer to form a metal pattern layer

Methodology Applied

Scientific EffectElectroless-plating: Electroplating

Data Source

PatentUS8871075B2Method of forming metal pattern and method of manufacturing display substrate having the same

Publication Date: 2014.10.28 SAMSUNG DISPLAY CO LTD

AI summary

A method of forming a metal pattern includes forming a precursor layer including a metal precursor on a substrate, irradiating a light on the precursor layer to form a metal seed layer having a predetermined pattern, and electroless-plating the metal seed layer to form a metal pattern layer.