Metal-Containing Resist Films for High-Resolution EUV Patterning
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Solution Overview
Problem
Existing substrate processing methods face challenges in forming precise and durable metal-containing resist films on underlying films using extreme ultraviolet light, particularly in achieving high resolution and selectivity in patterning semiconductor substrates.
Innovation Solution
A substrate processing method involving the use of a metal-containing precursor with a photosensitive group and a polyfunctional compound, along with gases like H2O, H2O2, and O3, to form a metal-containing resist film, followed by exposure and development to create selective regions, utilizing a substrate processing system with heating, plasma, and liquid processing systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional substrate processing methods are used to form metal-containing resist films, then the manufacturing process is simpler, but the resolution and selectivity in patterning are insufficient
Solution Approach 1:
The patent applies preliminary action by performing surface treatment on the underlying film before forming the metal-containing resist film. This includes irradiating the underlying film with extreme ultraviolet light or applying a self-aligned undercoat, which prepares the surface to enhance subsequent metal-containing resist film formation and improves patterning resolution without adding complex processing steps
Solution Approach 2:
The patent uses composite materials by forming a metal-containing resist film that combines metal compounds with resist materials. This composite structure enables both the adhesion benefits of metal compounds and the photosensitivity of resist materials, achieving high resolution and selectivity in patterning while maintaining processability
2Manufacturing precision
If metal-containing resist films are formed to improve patterning precision, then resolution and selectivity are enhanced, but the process steps and system complexity increase
Solution Approach 1:
The patent applies universality by designing a substrate processing system that can perform multiple functions using the same equipment. The system can switch between forming metal-containing resist films, conventional resist films, and performing surface treatment, eliminating the need for separate specialized equipment and reducing overall system complexity despite the advanced processing capabilities
3Reliability
If surface treatment is performed before forming metal-containing resist film, then adhesion and patterning quality improve, but additional process steps are required
Solution Approach 1:
The patent performs surface treatment as a preliminary action before forming the metal-containing resist film. This includes irradiating the underlying film with extreme ultraviolet light or applying a self-aligned undercoat, which prepares the surface to enhance adhesion and patterning quality. The self-aligned approach ensures precise positioning without additional alignment steps that would reduce productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of precise metal-containing resist films with improved resolution and selectivity, facilitating advanced patterning of semiconductor substrates, enhancing the manufacturing process for devices like DRAM and 3D-NAND flash memory.
Implementation Method 1
the metal-containing precursor having a photosensitive group
Implementation Method 2
utilizing a substrate processing system with heating, plasma, and liquid processing systems
Implementation Method 3
utilizing a substrate processing system with heating, plasma, and liquid processing systems
Data Source
AI summary
In one exemplary embodiment, a substrate processing method includes (a) providing a substrate including an underlying film; and (b) forming a metal-containing resist film on the underlying film by using a metal-containing precursor and a polyfunctional compound, the metal-containing precursor having a photosensitive group.