Metal Strip Flip-Chip Packaging for Low-Parasitic Semiconductor Packages
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Solution Overview
Problem
Semiconductor devices are highly sensitive to parasitic electrical effects such as parasitic interconnect resistance and inductance, which existing methods to reduce often result in higher costs, larger package size, and reduced device performance.
Innovation Solution
A method involving a metal strip for flip chip bonding, where semiconductor dies are mounted in a flip chip arrangement, encapsulated with an insulating material, and package terminals are formed from the metal strip or deposited metal, reducing parasitic effects and package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional packaging methods are used to reduce parasitic electrical effects, then parasitic resistance and inductance are reduced, but package size increases and manufacturing cost increases
Solution Approach 1:
The patent merges the substrate and package leadframe into a single integrated metal strip structure. The metal strip serves dual functions as both the substrate for mounting semiconductor dies and the package leadframe providing external electrical connections. This integration eliminates the need for separate substrate and leadframe components, reducing overall package size while maintaining low parasitic electrical effects through direct electrical pathways.
Solution Approach 2:
The metal strip performs multiple functions simultaneously: it acts as the substrate for die mounting, provides the package leadframe for external connections, and serves as the electrical interconnect structure. This multi-functionality reduces the number of separate components needed, thereby reducing package size and manufacturing complexity while maintaining electrical performance.
2Object-affected harmful factors
If conventional packaging methods are used to reduce parasitic electrical effects, then parasitic resistance and inductance are reduced, but manufacturing cost increases
Solution Approach 1:
The integration of substrate and leadframe into a single metal strip reduces the number of assembly steps and components. This simplification lowers manufacturing complexity and cost while maintaining the electrical performance benefits of reduced parasitic effects.
Solution Approach 2:
The patent changes the physical state and configuration of the metal strip through various processing steps including forming, cutting, and shaping to create the final package structure. These parameter changes enable the metal strip to transition from a simple strip to a complex integrated structure with low parasitic effects, achieving high performance through material utilization rather than adding expensive components.
3Object-affected harmful factors
If flip chip arrangement is used with metal strip, then parasitic electrical connections are reduced and package size is reduced, but manufacturing process complexity increases
Solution Approach 1:
The metal strip is pre-formed with specific geometric configurations and electrical connection patterns before semiconductor dies are mounted. This preliminary structuring of the substrate/leadframe integration simplifies subsequent assembly steps, as the electrical pathways are already established, reducing overall manufacturing process complexity despite the advanced flip chip technique used.
Data Source
AI summary
A method of forming one or more semiconductor packages includes mounting one or more semiconductor dies on the metal strip such that the one or more semiconductor dies are in a flip chip arrangement whereby terminals of the one or more semiconductor dies face the upper surface of the metal strip, forming an electrically insulating encapsulant material on the upper surface of the metal strip that encapsulates the one or more semiconductor dies, and forming package terminals that are electrically connected with the terminals of the one or more semiconductor dies, wherein the package terminals are formed from the metal strip or from metal that is deposited after removing the metal strip.