Metal-Stud Semiconductor Packaging for Compact, Reliable Die Embedding
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Solution Overview
Problem
Conventional semiconductor packages face issues such as excess cost, decreased reliability due to thermal and mechanical stress, and large package sizes.
Innovation Solution
The use of metal studs to secure semiconductor dies within an encapsulant, combined with a dielectric layer and a redistribution structure, provides a more reliable and compact packaging solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but package size becomes too large
Solution Approach 1:
The semiconductor die is embedded within a cavity formed in the encapsulant, creating a nested structure where the die is housed inside the encapsulant material. This nesting approach reduces the overall package volume by efficiently utilizing the encapsulant space rather than adding separate mounting structures.
Solution Approach 2:
The invention transitions from conventional planar packaging to a three-dimensional structure by forming a cavity within the encapsulant and embedding the die vertically within it. This dimensional change allows for compact packaging by utilizing vertical space rather than only horizontal expansion.
2Reliability
If conventional semiconductor packaging methods are used, then manufacturing process simplicity is maintained, but reliability decreases due to thermal and mechanical stress
Solution Approach 1:
The encapsulant material surrounding the semiconductor die acts as a cushioning structure that absorbs and distributes thermal and mechanical stresses before they can damage the die. The cavity design allows the encapsulant to conformally surround the die, providing preemptive stress protection.
Solution Approach 2:
The packaging structure combines different materials with complementary properties: the encapsulant material provides mechanical protection and stress distribution, while the semiconductor die provides electronic functionality. This composite approach enhances overall reliability by leveraging the strengths of each material.
3Volume of moving object
If conventional semiconductor packaging methods are used, then manufacturing cost is controlled, but package size becomes too large
Solution Approach 1:
The invention merges the encapsulant formation and die mounting steps into a single integrated process. The cavity is formed in the encapsulant, and the die is embedded during the same manufacturing sequence, eliminating the need for separate die attachment and encapsulation steps. This consolidation reduces package size while maintaining manufacturing efficiency.
Data Source
AI summary
An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.