Metal Substrate Heat Dissipation via Circuit Board Pressing
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently dissipating heat due to the increased production costs associated with forming projections, mounting holes, and using metal masks to control the thickness and shape of heat conductive materials, which affects the thermal conductivity and reliability of heat dissipation.
Innovation Solution
A semiconductor device configuration featuring a circuit board with a semiconductor element, a metal substrate, and a storage member with a concave surface and screw holes, allowing for the even application and thin-layer spreading of heat conductive material between the metal substrate and a heat dissipation member, improving thermal conductivity and air tightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of heat conductive material is reduced to improve heat dissipation, then thermal conductivity improves, but manufacturing complexity increases due to need for projections, mounting holes, and metal masks
Solution Approach 1:
The invention extracts and eliminates the complex metal mask and projection formation processes from the manufacturing flow. Instead of using traditional methods requiring masks and hole formations, the patent uses a simple pressing operation with the circuit board itself to spread the heat conductive material uniformly, thereby removing unnecessary manufacturing steps while achieving thin, even material distribution.
Solution Approach 2:
The circuit board serves a dual function: as both the mounting substrate and as the pressing tool to spread the heat conductive material. By utilizing the circuit board's own structure and rigidity to apply pressure and spread the material during assembly, the invention eliminates the need for separate masking and projection-forming processes, achieving self-service in the material distribution process.
2Reliability
If heat conductive material is applied in a thin layer to improve thermal conductivity, then heat dissipation improves, but material application precision becomes more difficult to control
Solution Approach 1:
The circuit board itself is used as the pressing instrument to control material thickness. During the assembly process, the circuit board is pressed against the heat conductive material, and its rigid structure ensures uniform pressure distribution, automatically controlling the material to spread into a consistent thin layer without requiring external precision control mechanisms.
Solution Approach 2:
The heat conductive material is applied in a relatively thick initial layer, and then the pressing action during assembly spreads it into the desired thin uniform layer. This preliminary application of excess material followed by mechanical spreading ensures that the material is always present in sufficient quantity before being distributed, preventing defects from insufficient material application.
3Reliability
If projections and mounting holes are formed on metal substrate to control heat conductive material shape, then heat dissipation improves, but production cost increases
Solution Approach 1:
The invention completely removes the metal mask and projection formation steps from the manufacturing process. Instead of creating complex metal substrate features, the patent relies on the circuit board's structure and pressing action to define and control the heat conductive material shape, thereby eliminating the need for expensive mask preparation and metal substrate modification.
Solution Approach 2:
The invention replaces expensive, complex metal masks and precision-formed metal substrate projections with a simple, inexpensive pressing operation using the circuit board itself. The circuit board serves as a reusable pressing tool, eliminating the need for single-use masks and complex metal working, thereby significantly reducing production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation by ensuring a thin, even layer of heat conductive material between the metal substrate and heat dissipation member, improving thermal conductivity and preventing bubble formation, thus increasing the reliability and efficiency of heat dissipation.
Implementation Method 1
a heat conductive material therebetween... improving thermal conductivity
Data Source
AI summary
A semiconductor device is fastened to a heat dissipation member such that a force directed downward acts from a metal substrate onto the heat dissipation member, with a rim portion of a storage region as a fulcrum with respect to the heat dissipation member. As a result, a heat conductive material can be spread into a thinner layer between the metal substrate and the heat dissipation member, improving the heat dissipation between the metal substrate and the heat dissipation member.