Metal-Substrate PCB Connector Structure for Reliable Cross-Line Connections
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Solution Overview
Problem
Existing aluminum substrate PCBs face challenges in ensuring reliable electrical connections between bare copper wires and the substrate due to the limitations of wave and reflow soldering methods, particularly in complex circuit designs with increased lamp bead usage and density, which complicates cross-line connections.
Innovation Solution
A PCB design featuring a metal substrate, insulating layer with through holes, and a connector that interferes fit within these holes to securely connect the metal substrate and circuit layer, ensuring stable electrical contact through laminating and forming specific blind or through holes for the connector placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wave soldering is used for cross-line connection of bare copper wire, then the layout and routing on PCB can be simplified, but large component patches cannot be installed
Solution Approach 1:
The patent divides the connection process into two distinct stages: first, wave soldering is used to connect bare copper wires for signal routing (simplifying layout), and second, reflow soldering is applied specifically for installing large component patches. This segmentation allows each soldering method to be optimized for its specific function without compromise.
2Adaptability or versatility
If reflow soldering is used for large component patches on aluminum substrate PCB, then large components can be installed, but reliable contact between bare copper wire and aluminum substrate cannot be ensured
Solution Approach 1:
The patent separates the soldering functions by applying wave soldering specifically for bare copper wire connections to ensure reliable electrical contact, and reflow soldering exclusively for large component patch installation. This functional segmentation ensures that each connection type is optimized for its specific requirements.
Solution Approach 2:
The patent introduces an intermediary structure (the bare copper wire connection layer) that facilitates reliable electrical contact between the aluminum substrate and the circuit components. This intermediary ensures that the reflow soldering process, which is optimized for large components, does not compromise the reliability of electrical contacts.
3Productivity
If the number of lamp beads increases and distribution becomes denser, then lighting performance is improved, but circuit design becomes more complicated
Solution Approach 1:
The patent replaces complex manual circuit routing with automated bare copper wire cross-line connections. This mechanical substitution allows for simplified circuit layouts even as the number of lamp beads increases, as the wire connections can be easily routed over existing circuits without requiring complex PCB trace designs.
Data Source
AI summary
A printed circuit board (PCB) and a manufacturing method thereof are provided. The PCB includes a metal substrate, an insulating layer, a circuit layer, and a connector. The insulating layer is disposed on a side of the metal substrate, and is provided with a through hole. The circuit layer is disposed on a side of the insulating layer away from the metal substrate. The connector is disposed in the through hole to electrically connect the metal substrate and the circuit layer.