Metal Via Test Structure for Early Open-Circuit Detection
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Solution Overview
Problem
The challenge in semiconductor technology is the difficulty in detecting via open circuits early due to the lack of direct connection between back-end metal and substrate, leading to delayed identification of filling issues during the metal via process, which can result in significant losses.
Innovation Solution
A test structure comprising a doped substrate, contact layer, first metal layer, first metal via layer, and second metal layer, where the contact layer connects the metal layer to the substrate, allowing for online detection using E-beam technology to assess metal filling in vias, thereby identifying potential open circuits promptly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal and substrate directly form a suspended structure in conventional test structures, then the structure is simple, but the via filling problem cannot be detected early leading to delayed quality control
Solution Approach 1:
The patent introduces a contact layer as an intermediary component between the metal layer and substrate. This contact layer includes contact plugs that physically connect the metal via structure to the substrate, enabling signal transmission and early detection of via filling defects. The intermediary contact layer resolves the detection problem while maintaining structural organization.
Solution Approach 2:
The test structure performs preliminary detection of via filling quality before actual production processes. By incorporating the contact layer that connects to the substrate, the structure enables early identification of filling defects during the testing phase, allowing process adjustments to be made before mass production, thus preventing wasted resources.
2Loss of time
If conventional WAT testing is used to detect via open circuits, then the detection method is simple, but the problem cannot be found early in the process leading to great impact
Solution Approach 1:
The test structure enables preliminary detection of via open circuits and filling defects before actual production. The contact layer connected to the substrate allows testing to be performed early in the process development phase, identifying issues before they affect mass production timelines and reducing overall development time.
Solution Approach 2:
The test structure is self-contained with all necessary components (substrate, contact layer, metal layers, vias) integrated in one structure. The contact layer automatically provides the connection path needed for detection, making the test structure self-sufficient and enabling immediate testing without additional external setup or complex measurement arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables early detection of via filling problems, reducing losses by allowing for timely intervention in the metal via process through the addition of a contact layer and E-beam inspection, improving the reliability of the semiconductor manufacturing process.
Implementation Method 1
detecting, by means of an E-beam technology, whether metal filling in the first via produces an open circuit
Data Source
AI summary
The present application provides a structure and method for online detection of a metal via open circuit, a contact layer is on the substrate, a first metal layer is on the contact layer, a first metal via layer is on the first metal layer, a second metal via layer is on the first metal via layer metal layer, the contact layer comprises a plurality of contacts, the plurality of contacts are connected to the first metal layer, the first metal via layer comprises a plurality of first vias, the plurality of first vias are filled with metal; detecting by means of an E-beam technology. A problem in the process can be found in advance, so as to solve the problem in time and thus stop losses as soon as possible.