Contactless Testing TRIZ Cases
- MOS Transistor Failure Detection via Recess Profile Analysis
Recess profiling after controlled wet etching reveals MOS transistor failure more accurately by protecting the substrate from profile distortion.
- 2D Nanoantenna Photodetector for LWIR Polarization Sensing
Resonant nanoantennas add anisotropy to a 2D photodetector, enabling on-chip LWIR spectral and polarization sensing without bulky spectrometers.
- Metal Via Test Structure for Early Open-Circuit Detection
An added contact layer enables E-beam inspection of metal via filling, exposing open circuits early and reducing semiconductor process losses.
- Antenna Test Fixture Layout for Interference-Free IC Testing
Grouped antennas and shielding via arrays cut interference in dense IC test fixtures, preserving signal integrity during sequential testing.
- Frontside SEM Fault Isolation for SPR Semiconductor Inspection
Frontside SEM e-beam probing with ATE bypasses blocked backside access in SPR chips, enabling dynamic fault isolation and process revision.
- Electron Beam NCEM Alignment on a Moving Wafer Stage
Real-time stage position feedback steers the electron beam during non-contact wafer testing, improving alignment accuracy and throughput.
- Moving-Stage Electron Beam Alignment for Non-Contact Electrical Measurement
Continuous stage motion can disrupt wafer targeting; position feedback adjusts electron-beam deflection for accurate NCEM.