Substrate Inspection Device Multi-Position Monitoring
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Solution Overview
Problem
Current semiconductor substrate inspection methods are inefficient in detecting processed states and abnormalities at high speeds, particularly as design rules shrink and systematic defects become more prevalent, impacting yield and requiring rapid technological advancements.
Innovation Solution
A device and method that includes a substrate mounting part, a measurement part, and a control part to monitor substrates from different positions, allowing for efficient analysis of substrate states and abnormality detection by controlling the movement path of the measurement part to cover various regions of multiple substrates, including those with the same predetermined process, and using overlapping regions to correct error ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional substrate inspection methods are used, then inspection can be performed, but inspection time is too long and cannot keep up with high-speed semiconductor manufacturing
Solution Approach 1:
The patent applies preliminary action by pre-dividing the substrate into multiple regions and pre-setting multiple measurement parts at different positions. This allows inspection to begin immediately when substrates are loaded, eliminating setup time and enabling continuous high-speed inspection that matches semiconductor manufacturing throughput.
Solution Approach 2:
The patent segments the inspection task by dividing the substrate into multiple regions and assigning different measurement parts to different regions. This parallel segmentation enables simultaneous inspection of multiple areas, dramatically reducing total inspection time while maintaining comprehensive coverage.
2Productivity
If design rules are reduced for higher integration, then device density increases, but systematic defects become more prevalent and harder to detect
Solution Approach 1:
The patent transitions from single-point inspection to multi-dimensional inspection by positioning multiple measurement parts at different locations and angles across the substrate. This dimensional expansion enables detection of spatially systematic defects that would be invisible to conventional single-point methods, improving reliability without sacrificing device density.
Solution Approach 2:
The patent merges multiple measurement parts into a coordinated inspection system that simultaneously monitors different substrate regions. This combination creates a comprehensive detection network capable of identifying systematic defects across the entire substrate, enhancing reliability for high-density designs.
3Reliability
If comprehensive substrate inspection is performed, then defect detection improves, but inspection time increases and productivity decreases
Solution Approach 1:
The patent ensures continuous useful action by having multiple measurement parts operate simultaneously and continuously across different substrate regions without idle time. This parallel continuous operation maintains high defect detection accuracy while maximizing inspection throughput, eliminating the trade-off between reliability and productivity.
Solution Approach 2:
The patent segments the comprehensive inspection task into parallel sub-tasks performed by multiple measurement parts. Each measurement part inspects its assigned region comprehensively, but all regions are inspected simultaneously, achieving overall comprehensive coverage without the sequential time penalty, thus maintaining both high reliability and productivity.
Data Source
AI summary
Provided are a device and a method for monitoring substrates to determine a processed state of the substrates and inspecting presence of abnormality in the processed substrates.A device for inspecting substrates includes a substrate mounting part moving relative to the substrate and for mounting a substrate, a measurement part for monitoring the substrate, a control part configured to control a movement path of the measurement part so that at least some regions are monitored from positions different from each other with respect to a plurality of substrates, and an analysis part configured to determine presence of abnormality from monitoring information about the plurality of substrates.