Metal Wire Loop Shape for Semiconductor Overcurrent Protection
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Solution Overview
Problem
Existing semiconductor devices face challenges in stably forming a loop shape of a metal wire functioning as a quick disconnection part to prevent secondary breakdown and minimize damage during overcurrent events, as the high loop shape required is difficult to form and maintain.
Innovation Solution
A semiconductor device design that includes a semiconductor element, terminal electrodes, internal wiring, and a sealing material, where the internal wiring features metal blocks and metal wires with a second metal wire bonded closer to the sealing material's surface, forming a gentle loop shape that functions as a quick disconnection point, facilitating easy assembly and identification of overcurrent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a high loop shape is formed to expose the wire on the surface of the sealing material for quick disconnection, then the overcurrent protection function is improved, but the manufacturing stability deteriorates because it is difficult to stably form such a high loop shape
Solution Approach 1:
The invention divides the wire bonding structure into multiple segments: a first wire bonding part connecting the semiconductor element to the sealing material surface, and a second wire bonding part extending from the sealing material surface to the terminal electrode. The loop shape is formed specifically in the first wire bonding part, which has a smaller height requirement compared to the conventional single high loop structure. This segmentation allows the loop to be formed more stably while still exposing the wire apex on the sealing material surface for effective overcurrent protection.
2Reliability
If the wire bonding part is curved to a large degree to expose the wire on the sealing material surface, then the quick disconnection capability is improved, but the assembly difficulty increases due to the high loop shape
Solution Approach 1:
By dividing the wire bonding into two parts with different functions and height requirements, the first part forms a gentle loop that is easier to assemble while the second part provides the necessary connection height. This segmentation reduces the overall assembly difficulty compared to forming a single high loop structure.
Solution Approach 2:
The invention changes the spatial arrangement by having the first wire bonding part extend in one direction (with the loop) and the second wire bonding part extend in another direction (to the terminal electrode). This dimensional change allows the loop to be formed with a smaller height requirement while still achieving the quick disconnection function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for a stable formation of a loop shape that functions as a quick disconnection point, effectively preventing semiconductor device damage during overcurrent events by ensuring easy assembly and clear identification of broken parts.
Implementation Method 1
When an overcurrent flows, the loop exposed on the surface of the press mass melts.
Data Source
AI summary
The semiconductor device includes a semiconductor element, a plurality of terminal electrodes, internal wiring, and a sealing material. The semiconductor element is mounted on a circuit pattern provided on an insulating substrate. The plurality of terminal electrodes are provided on a case in which the insulating substrate and the semiconductor element are contained. The internal wiring connects the semiconductor element and the plurality of terminal electrodes. The sealing material fills a space in the case. The internal wiring includes a plurality of circuit patterns, a plurality of metal blocks, and metal wire. The plurality of metal blocks are electrically connected to the respective circuit patterns. The metal wire connects the plurality of metal blocks and is bonded to the plurality of metal blocks at positions closer to an upper surface of the sealing material than surfaces of the plurality of circuit patterns.