Metallic Lid Structure With TSV Heat Paths for IC Hotspots
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Solution Overview
Problem
As semiconductor fabrication advances, IC chips generate heat that is not dissipated quickly, leading to overheating, performance degradation, and potential failures due to thermal hotspot regions.
Innovation Solution
Implementing a metallic lid structure with copper and thermally conductive TSVs to rapidly dissipate heat from thermal hotspot regions through metallization layers and a thermal interface material, ensuring efficient heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional IC chip structures are used, then device complexity is reduced, but heat dissipation capability deteriorates leading to thermal hotspot regions
Solution Approach 1:
The lid structure is segmented into multiple functional layers including a body portion, flange portion, and integrated heat spreader with varying thickness regions. The heat spreader includes a first region with first thickness and a second region with second thickness, creating localized thermal management zones that address hotspot regions while maintaining overall structural integrity
Solution Approach 2:
The patent merges multiple functions into a single integrated lid structure: thermal management (heat dissipation and spreading), mechanical support (structural rigidity), and electrical connectivity (bonding pads). The flange portion integrates bonding pads directly into the structural element, eliminating the need for separate bonding layers and reducing overall device complexity
2Productivity
If advanced technology nodes are used, then functional density increases, but heat generation increases and heat dissipation becomes insufficient
Solution Approach 1:
The heat spreader features non-uniform thickness distribution with a first region having a first thickness and a second region having a second thickness. This local variation in geometry creates zones with different thermal masses and heat capacity, allowing optimized heat dissipation tailored to specific hotspot locations while maintaining high functional density
Solution Approach 2:
The lid structure extends into the vertical dimension with multiple thickness levels and layered construction. The heat spreader's varying thickness profile adds a dimensional aspect to thermal management, creating a three-dimensional thermal conduction path that enhances heat dissipation capability without increasing planar footprint
3Volume of moving object
If thin structures are used to optimize dimensions, then device size is reduced, but structural rigidity deteriorates
Solution Approach 1:
The lid structure is formed from copper or copper alloy material that provides high thermal conductivity while maintaining structural strength. The composite nature of the integrated structure with flange portion and heat spreader creates a rigid assembly that achieves optimal dimensions without sacrificing mechanical integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves device performance, reliability, and lifespan by effectively dissipating heat generated by thermal hotspot regions, maintaining structural rigidity, and optimizing device dimensions.
Implementation Method 1
a metallic lid structure with copper and thermally conductive TSVs to rapidly dissipate heat from thermal hotspot regions through metallization layers and a thermal interface material
Data Source
AI summary
An Integrated Circuit (IC) structure includes a bottom level IC die and one or more top level IC dies. A first side of the one or more top level IC dies is bonded to the bottom IC die. A supporting substrate is coupled to a second side of the one or more top level IC dies. A plurality of conductive through-substrate vias (TSVs) each extend vertically through the supporting substrate. A metallic lid structure is disposed over the supporting substrate. The metallic lid structure is thermally coupled to the conductive TSVs.