Metallic Pattern Formation on Polymer Substrates
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Solution Overview
Problem
The high production costs associated with miniaturizing portable electronic devices due to the need for specialized materials and instruments in laser direct structuring (LDS) technology for forming complex circuitry and antennas.
Innovation Solution
A method involving the formation of a metallic pattern on a polymer substrate using a mixture layer with nanoparticles and an active carrier medium, treated by a laser process to create seed residues, followed by an electroless plating process, which allows for precise pattern formation without requiring LDS-specific materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LDS technology is used to form metallic patterns on polymer substrates, then pattern formation precision is improved, but production cost increases due to specialized materials and instruments
Solution Approach 1:
The patent replaces expensive LDS-specific polymer substrates with ordinary polymer substrates coated with a disposable ink layer containing metal particles. The ink layer is consumed in the laser treatment process to create conductive patterns, eliminating the need for costly specialized substrates while maintaining pattern formation precision
Solution Approach 2:
The patent changes the material parameters by using ordinary polymers with metal particle inks instead of LDS-specific polymers. The laser parameters (wavelength, power, scanning speed) are optimized to selectively remove the polymer matrix and expose metal particles, achieving precise pattern formation with standard materials
2Ease of manufacture
If ordinary polymer substrates are used instead of LDS-specific substrates, then production cost is reduced, but pattern formation capability deteriorates
Solution Approach 1:
The patent introduces an intermediary ink layer containing metal particles and polymer matrix. This intermediate layer mediates between the ordinary polymer substrate and the laser processing, enabling selective removal of the matrix to expose conductive metal particles and form precise patterns on cost-effective substrates
Solution Approach 2:
The patent uses composite materials by combining ordinary polymer substrates with metal particle-containing ink layers. The composite structure allows laser selective removal of the polymer component while retaining metal particles, achieving pattern formation capability on inexpensive substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces production costs while maintaining high-quality, precise pattern formation on various polymer substrates, enabling the creation of metallic patterns for electronic devices without the need for expensive LDS-specific materials, offering flexibility in substrate choices and improved pattern fidelity.
Implementation Method 1
A laser process is then performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate
Implementation Method 2
The laser process is performed by using a UV laser at 355 nm with a power of 0.2 ̃0.4 W
Implementation Method 3
the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate
Data Source
AI summary
A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.