Metallized Optical Fiber Array With Elasto-Plastic Interfaces
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Solution Overview
Problem
Conventional optical fiber array modules face challenges in accurately and securely retaining optical fibers due to variations in fiber diameters, and existing solutions like soldering and epoxy adhesives introduce fabrication costs and complexity, as well as potential degradation over time.
Innovation Solution
The optical fiber array module employs elasto-plastic interfaces formed by softer materials at the interfaces between the optical fibers and the substrate and cover, allowing for mechanical deformation to accommodate fiber diameter variations without the need for solder or epoxy interfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy adhesive is used to fix optical fibers to substrate grooves, then fiber retention is achieved, but fabrication complexity and cost increase due to curing processes
Solution Approach 1:
The patent removes the epoxy adhesive layer from the fiber array module structure, replacing it with a mechanical retention system using V-grooves and a cover plate. This extraction eliminates the curing process and associated fabrication complexity while maintaining fiber retention through purely mechanical means.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (epoxy adhesive curing) with a mechanical retention system consisting of V-grooves that physically hold the fibers and a cover plate that secures them in place. This substitution eliminates the need for thermal or UV curing processes.
2Reliability
If solder is used to attach optical fibers to substrate grooves, then fiber retention is improved, but fabrication cost and process complexity significantly increase
Solution Approach 1:
The patent extracts the solder material from the fiber array module structure, replacing it with a mechanical retention system. This removal eliminates the expensive soldering process and associated fabrication costs while maintaining fiber retention through V-groove mechanical support.
Solution Approach 2:
The patent employs inexpensive mechanical components (V-grooves in substrate, simple cover plate) instead of expensive soldering processes. The mechanical retention system achieves the same functional outcome at significantly lower fabrication cost.
3Adaptability or versatility
If epoxy adhesive is used as filler for fiber diameter variations, then accommodation of variations is achieved, but alignment precision deteriorates due to lack of reference surface
Solution Approach 1:
The patent replaces the epoxy filler system with a mechanical V-groove system that provides rigid geometric reference surfaces. The V-grooves define precise locations for fiber centers, enabling accurate alignment reference surfaces without relying on adhesive filler material.
Solution Approach 2:
The V-grooves are pre-formed in the substrate with precise geometry before fiber insertion. This preliminary action establishes the alignment reference surfaces in advance, ensuring that fiber positioning accuracy is determined by the groove geometry rather than by adhesive filler application.
4Reliability
If solder reflow process is used to attach fibers, then fiber retention is improved, but fiber and substrate integrity deteriorate due to heat exposure
Solution Approach 1:
The patent replaces the thermal solder reflow process with a purely mechanical retention system using V-grooves and cover plate. This substitution eliminates exposure to high temperatures that could degrade fiber and substrate integrity while achieving the same fiber retention function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures accurate and secure retention of optical fibers within anticipated tolerance, reducing fabrication costs and complexity while maintaining reliability and alignment precision over time.
Implementation Method 1
the interface portions are of a softer material than the substrate and the cover so as to deform elastically and/or plastically
Implementation Method 2
the interface portions are of a softer material than the substrate and the cover so as to deform elastically and/or plastically
Data Source
AI summary
An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.