(Meth)acrylic Resin Conductive Paste for Multilayer Ceramic Components
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Solution Overview
Problem
Conductive pastes with polyvinyl acetal or modified polyvinyl acetal resins exhibit low adhesion to ceramic green sheets and can damage them due to solubility issues, leading to structural defects and stacking displacement in multilayer ceramic electronic components.
Innovation Solution
A conductive paste comprising a (meth)acrylic resin with a glass transition point between −60° C. and 120° C., hydroxyl group content of 0.01% to 5% by weight, acid value of 1 mgKOH/g to 50 mgKOH/g, and weight-average molecular weight of 10,000 to 350,000 Mw, along with metal powder and an organic solvent, which improves adhesion and prevents damage to ceramic green sheets during the manufacturing process of multilayer ceramic electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polyvinyl acetal or modified polyvinyl acetal resin is used as binder resin, then the paste can be manufactured with certain adhesion properties, but the adhesion to ceramic green sheets is low and the resin can damage the sheets due to solubility issues
Solution Approach 1:
The patent changes the chemical composition parameters of the binder resin from polyvinyl acetal to (meth)acrylic resin with specific molecular weight (10,000-350,000), glass transition temperature (−60°C to 120°C), and functional group content. This parameter change resolves the contradiction by providing both adequate adhesion and compatibility with ceramic green sheets, preventing solvent-induced damage while maintaining bonding strength.
Solution Approach 2:
The patent uses a composite binder resin system comprising (meth)acrylic resin combined with specific metal powder particles. This composite approach enhances adhesion to ceramic green sheets while the controlled solubility parameters prevent damage to the sheets, simultaneously addressing both requirements of the contradiction.
2Ease of operation
If the binder resin has high solubility in organic solvents, then the paste can be applied smoothly, but the solvent can dissolve and damage the ceramic green sheet structure
Solution Approach 1:
The patent carefully selects (meth)acrylic resin with specific molecular weight and glass transition temperature parameters that provide optimal balance between solubility for smooth printing and low enough solubility to prevent green sheet damage. This parameter optimization resolves the contradiction between ease of application and structural reliability.
3Strength
If the glass transition point of the (meth)acrylic resin is kept low for good adhesion, then adhesion improves, but the resin may become too soft and cause stacking displacement
Solution Approach 1:
The patent optimizes the glass transition temperature parameter of the (meth)acrylic resin within the range of −60°C to 120°C, finding the optimal balance point that provides sufficient adhesion while maintaining adequate rigidity to prevent stacking displacement. This parameter optimization resolves the contradiction between adhesion strength and stacking precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved adhesion and solubility parameters allow for enhanced contact between the conductive paste and ceramic green sheets, reducing stacking displacement and structural defects, while avoiding solvent-induced damage, thus facilitating the production of high-quality multilayer ceramic electronic components.
Implementation Method 1
The improved adhesion and solubility parameters allow for enhanced contact between the conductive paste and ceramic green sheets
Data Source
AI summary
A conductive paste that includes a (meth)acrylic resin serving as a binder resin, an organic solvent, and a metal powder. The (meth)acrylic resin has a glass transition point Tg in the range of −60° C. to 120° C., a hydroxyl group content in the range of 0.01% to 5% by weight per molecule, an acid value in the range of 1 to 50 mgKOH/g, and a weight-average molecular weight in the range of 10,000 to 350,000 Mw.