Micro Component Structure With Patterned Fixing For Transfer Yield
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Solution Overview
Problem
The increasing size and density of micro LEDs complicate the manufacturing of fixing structures for transferring them between carrier and receiving substrates, affecting yield due to the contact surface area and shape, leading to difficulties in transportation and transfer.
Innovation Solution
A micro component structure with a fixing structure featuring patterned designs, such as grooves or openings, that adjust bonding strength and improve yield by controlling the breaking point and support force during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the micro LED size is reduced and density is increased, then the light emitting performance is improved, but the manufacturing difficulty of the fixing structure is increased
Solution Approach 1:
The fixing structure is divided into multiple connecting portions with patterned structures (grooves or openings), where each segment independently contributes to holding the micro LED. This segmentation allows the complex fixing function to be distributed across multiple simpler structural elements, making manufacturing more feasible despite increased micro LED density
Solution Approach 2:
Patterned structures are applied locally at specific connecting portions rather than uniformly across the entire fixing structure. The grooves or openings are strategically positioned to provide enhanced bonding strength where needed, allowing differential structural properties that simplify overall manufacturing while maintaining high-density micro LED support
2Reliability
If the contact surface area and shape of the fixing structure are changed, then the transfer yield is affected, but the ease of manufacture is reduced
Solution Approach 1:
The patterned structures modify local geometric parameters (creating grooves or openings) at the connecting portions, which changes the contact surface characteristics and bonding strength distribution. These parameter changes improve transfer yield by optimizing the interaction between fixing structure and micro LED, while the systematic nature of the patterning maintains manufacturing feasibility
Data Source
AI summary
A micro component structure includes a substrate, at least one micro component and a fixing structure. The micro component is disposed on the substrate, has a spacing from the substrate and has at least one top surface. The fixing structure is disposed on the substrate and includes at least one covering portion and at least one connecting portion. The covering portion is disposed on a portion of the top surface of the micro component, and the connecting portion is connected to an edge of the covering portion and extends onto the substrate. At least one of the covering portion and the connecting portion includes at least one patterned structure.