Micro-Cooler Assembly with Graded Channels for Even Hot-Spot Cooling
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Solution Overview
Problem
Conventional micro-cooler assemblies struggle to provide even cooling fluid distribution across small-scale electronic devices, especially at higher temperatures and in applications with localized hot spots.
Innovation Solution
The proposed micro-cooler assemblies incorporate a manifold and a cold plate with micro-channels and vapor gaps, utilizing a wicking action to distribute cooling fluid and efficiently vaporize it to remove heat, with the vaporized fluid returning to a liquid supply for re-cooling and re-use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional cooling systems are used with small-scale micro-coolers, then the device size is reduced, but the cooling fluid coverage becomes inadequate
Solution Approach 1:
The patent employs a wick structure with porous material to enable capillary action for cooling fluid distribution. The porous wick material allows the cooling fluid to be drawn through the micro-cooler structure without requiring external pumping, ensuring adequate fluid coverage across the entire micro-cooler surface even in small-scale applications.
Solution Approach 2:
The micro-cooler is segmented into multiple micro-channels arranged in a specific pattern, with each channel receiving cooling fluid through capillary action. This segmentation allows the cooling fluid to be distributed evenly across multiple pathways, ensuring comprehensive coverage despite the reduced overall device size.
2Quantity of substance
If cooling fluid coverage is increased to maintain adequate cooling, then the device complexity increases
Solution Approach 1:
The micro-cooler design utilizes self-service through capillary action, where the porous wick material automatically draws cooling fluid through the micro-channels without requiring external pumps or complex distribution mechanisms. This self-service approach maintains adequate cooling fluid coverage while minimizing device complexity.
Solution Approach 2:
The patent replaces mechanical pumping systems with capillary action driven by the porous wick material. This substitution eliminates the need for complex mechanical components, reducing device complexity while maintaining effective cooling fluid distribution across the micro-cooler.
3Quantity of substance
If micro-channels are used to improve cooling fluid distribution, then the vapor evacuation becomes challenging
Solution Approach 1:
The micro-cooler incorporates multiple discrete micro-channels segmented throughout the structure, each capable of independently evaporating cooling fluid and evacuating vapor. This segmentation allows vapor to be evacuated through multiple pathways simultaneously, preventing vapor accumulation despite the presence of numerous micro-channels.
Solution Approach 2:
The patent introduces vapor evacuation pathways that extend in additional dimensions beyond the micro-channel plane. By creating three-dimensional vapor escape routes, the design facilitates efficient vapor removal while maintaining the benefits of micro-channel cooling fluid distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves more even cooling fluid distribution and effective vapor evacuation across the entire electronic device, improving cooling efficiency compared to conventional systems.
Implementation Method 1
Cooling fluid may be flowed through micro-channels formed in the micro-cooler via wicking action
Implementation Method 2
Heat from the electronic device may vaporize the cooling fluid
Data Source
AI summary
In one embodiment, a micro-cooler assembly includes a manifold having at least one inlet for receiving a liquid, a plurality of fins, wherein each fin of the plurality of fins includes a micro-channel, and a plurality of vapor gaps interlaced with the plurality of fins. A width of the micro-channels is graded, and/or a width of the vapor gaps is graded. The micro-cooler assembly further includes a cold plate that includes a surface and a wick region disposed on the surface. The manifold is coupled to the surface of the cold plate. The at least one inlet is operable to provide the liquid proximate the wick region. The liquid is operable to be wicked into the wick region through the micro-channels of the plurality of fins, and heating of the liquid changes phase to a vapor that exits the manifold through the plurality of vapor gaps.