Micro Device Alignment Using Asymmetric Receiving Parts
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Solution Overview
Problem
Current micro device transfer methods face challenges in reliably aligning the surface and direction of micro LED devices during the transfer process, leading to high alignment errors and reduced production rates due to the complexity of handling micro devices with sizes ranging from 1 to 100 micrometers.
Innovation Solution
A micro device alignment apparatus with receiving parts designed to match the unique top view shapes of micro devices, allowing for simultaneous surface and direction alignment, utilizing anodized film materials for precision and thermal stability, and a picker head capable of ascending and descending to facilitate accurate placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fluid transfer method is used to transfer micro devices all together at once, then production rate is improved, but alignment precision deteriorates due to high probability of inverted surfaces and incorrect terminal alignment
Solution Approach 1:
The patent applies preliminary action by pre-forming asymmetric receiving parts in the alignment apparatus before the transfer process. These receiving parts are designed with specific shapes that correspond to the micro device geometry, enabling automatic orientation and surface alignment during fluid transfer. This preliminary preparation of the receiving structure ensures that even when devices are transferred in bulk via fluid method, they are automatically oriented correctly without requiring post-transfer alignment repairs, thus maintaining both high productivity and alignment precision.
2Manufacturing precision
If head transfer method is used to transfer micro devices individually, then alignment precision is improved, but production rate deteriorates due to time-consuming repair of transfer errors
Solution Approach 1:
The patent implements self-service by designing receiving parts that automatically orient and position micro devices during the transfer process. The asymmetric shape of the receiving parts interacts with the micro device geometry to automatically correct orientation and surface alignment without requiring external intervention or repair operations. This self-aligning mechanism enables bulk transfer via fluid method while maintaining alignment precision, eliminating the need for time-consuming manual repairs and thus improving production rate while preserving alignment quality.
3Ease of manufacture
If symmetric top view shape is used for micro device, then ease of manufacture is improved, but alignment capability deteriorates because inverted surfaces and rotated positions become indistinguishable
Solution Approach 1:
The patent applies asymmetry by designing receiving parts with asymmetric shapes that correspond to the micro device top view shape. The asymmetric receiving part geometry creates unique orientation cues that allow the system to distinguish between inverted surfaces and different rotational positions. This asymmetric design enables automatic alignment during transfer while maintaining manufacturing simplicity, as the asymmetric features can be easily incorporated into the receiving part structure without complex manufacturing processes.
Data Source
AI summary
A micro device, a micro device alignment apparatus, and an alignment method using the same are proposed. In a micro device that has to be aligned with at least any one surface of front and rear surfaces of the micro device when mounted on a substrate and simultaneously be aligned with any one direction of the micro device when mounted on the substrate, there is provided the micro device, the micro device alignment apparatus, and the alignment method using the same so that surface alignment and direction alignment are simultaneously performed for a plurality of micro devices that is not aligned with at least any one surface of the front and rear surfaces and simultaneously is not aligned with any one direction.