Micro-Device Connecting Layer Structure Against Contact Detachment
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Solution Overview
Problem
Current micro devices with stabilization posts suffer from weak connections between the posts and conductive contacts, leading to detachment due to mechanical movements or external factors, compromising their stability and reliability.
Innovation Solution
A micro device design featuring a securing layer and a connecting layer that interconnects micro device units, providing a robust connection to the securing layer and maintaining the units' separation, thereby enhancing stability and preventing detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If stabilization posts are used to support micro devices, then the micro devices can be supported and positioned, but the connection between the posts and conductive contacts is weak, leading to detachment under mechanical stress
Solution Approach 1:
The patent employs a composite structure consisting of a stabilization post and a connecting layer with adhesive properties. This composite design combines the mechanical support function of the post with the bonding capability of the adhesive layer, creating a robust connection that prevents detachment while maintaining positional stability of the micro device units.
2Productivity
If micro device units are closely arranged to achieve high density, then productivity and space utilization improve, but the risk of detachment increases due to reduced spacing for connection structures
Solution Approach 1:
The patent extends the connection solution from a vertical dimension (posts only) to include a horizontal dimension through the connecting layer that spans between adjacent micro device units. This dimensional expansion allows for stronger bonding without increasing vertical height, enabling high-density arrangements while maintaining connection reliability through the adhesive connecting layer that bridges gaps between closely spaced units.
Data Source
AI summary
A micro device includes a securing layer, a plurality of micro device units that are separated from each other and that are spaced apart from the securing layer, and a connecting layer that interconnects the micro device units in at least one group of two or more and that is connected to the securing layer so that the micro device units are connected to the securing layer through the connecting layer. A method of making the micro device is also provided.