Micro-Device Pockets for Dense Printed Component Integration
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Solution Overview
Problem
There is a need for structures and methods to micro-assemble components comprising different materials into useful systems with a small footprint, as existing methods struggle to create densely packed and compact micro-systems.
Innovation Solution
The solution involves creating a micro-device structure with an insulating layer and a micro-device disposed on it, featuring a pocket that extends through the micro-device to the insulating layer, where a non-native micro-component can be disposed. This structure allows for the integration of micro-components within the micro-device, enabling a more densely packed and smaller system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If components are assembled on substrate using individually packaged surface-mount integrated-circuit devices and pick-and-place tools, then manufacturing precision is improved, but device complexity and area increase
Solution Approach 1:
The substrate is segmented into multiple pockets, each capable of holding individual micro-components. This segmentation allows precise positioning of components within defined pockets while simplifying the overall assembly process through standardized pocket structures that can be mass-produced.
Solution Approach 2:
Micro-components are nested within pockets formed in the substrate. This nesting approach integrates components directly into the substrate structure, reducing the need for separate packaging and assembly steps while maintaining precise component positioning.
2Device complexity
If sputtering or spin coating semiconductor material layers are used to form thin-film circuits, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The substrate is divided into discrete pockets with precise geometric definitions. These segmented pockets provide physical boundaries and alignment features that enable precise component placement without requiring complex photolithographic patterning, thus reducing fabrication complexity while maintaining precision.
Solution Approach 2:
The pockets act as intermediary structures between the substrate and micro-components. These pre-formed pockets serve as standardized interfaces that simplify the integration process while ensuring precise component positioning, bridging the gap between simple substrate fabrication and precise component assembly.
3Area of moving object
If micro-components are integrated into a compact micro-device structure, then area is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The substrate is segmented into multiple discrete pockets, each serving as a dedicated housing for micro-components. This segmentation enables compact integration of multiple components in a small area while the standardized pocket structures provide built-in positioning references that maintain manufacturing precision even at reduced scales.
Solution Approach 2:
Multiple micro-components are nested within pockets in the substrate, creating a densely packed three-dimensional arrangement. This nesting approach maximizes area utilization while the pocket structures provide mechanical constraints and alignment features that ensure precise component positioning despite the compact footprint.
Data Source
AI summary
A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.