Micro Device Transfer Carrier With Segmented Protrusions
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Solution Overview
Problem
Current micro light-emitting diode display manufacturing techniques face challenges such as high production costs, low transfer success rates, and poor alignment accuracy due to the use of electrostatic force, van der Waals forces, and viscous materials, which hinder efficient mass transfer of micro devices onto a driver circuit backplate.
Innovation Solution
A carrier structure with transfer units having transfer parts with smaller transfer surfaces than the micro devices, allowing for even stress distribution and increased process latitude, and a micro device structure that supports micro devices with a carrier structure featuring transfer units with varying spacing and surface alignment to enhance transfer efficiency and supporting force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrostatic force is used to extract dies, then mass transfer can be achieved, but the risk of arcing and dielectric breakdown increases due to higher external voltage requirements
Solution Approach 1:
The patent replaces electrostatic extraction with a mechanical extraction system where a stamper with protrusions physically contacts and extracts dies from the wafer. This mechanical approach eliminates the need for high external voltages, thereby avoiding arcing and dielectric breakdown while maintaining mass transfer capability
Solution Approach 2:
The patent introduces a stamper as an intermediary mechanical element between the extraction system and the dies. The stamper with its array of protrusions serves as a mediator that transfers mechanical force to extract multiple dies simultaneously, replacing the direct electrostatic field approach with a controlled mechanical interaction
2Productivity
If van der Waals force is used to extract dies, then transfer can be achieved, but precise control of stamper contact rate is needed and transfer success rate is low
Solution Approach 1:
The patent segments the extraction system into a stamper with multiple discrete protrusions, each corresponding to a specific die location. This segmentation allows for precise control of contact points and forces, improving transfer success rate by ensuring each die is extracted at the correct position with appropriate force
Solution Approach 2:
The patent changes the extraction mechanism from relying on van der Waals forces to using mechanical protrusions that physically engage with the dies. This parameter change from adhesive forces to mechanical contact eliminates the need for precise control of contact rates and significantly improves transfer success rate
3Productivity
If viscous material is used to bond dies, then transfer can be achieved, but adhesion is uneven and alignment accuracy is poor
Solution Approach 1:
The patent replaces the viscous material bonding method with a mechanical system where protrusions on the stamper directly contact and transfer dies. This eliminates the adhesion unevenness and alignment issues associated with viscous materials, providing precise mechanical positioning and transfer
Solution Approach 2:
The patent extracts the bonding function by eliminating the need for viscous materials entirely. The mechanical protrusions directly engage with and lift the dies, transferring them to the target substrate without requiring any adhesive layer, thereby achieving both uniform adhesion and high alignment accuracy
4Strength
If support structure is disposed on peripheral surface of dies, then dies can be supported, but dense arrangement on transfer carrier cannot be achieved
Solution Approach 1:
The patent moves the support function from the peripheral surface (2D plane) to the undersurface (3D space below the die). The protrusions extend downward to support the dies from below, allowing the peripheral surface to remain fully available for dense arrangement on the transfer carrier, thus achieving both supporting force and mass transfer efficiency
Data Source
AI summary
A carrier structure suitable for transferring or supporting a plurality of micro devices including a carrier and a plurality of transfer units is provided. The transfer units are disposed on the carrier. Each of the transfer units includes a plurality of transfer parts. Each of the transfer parts has a transfer surface. Each of the micro devices has a device surface. The transfer surfaces of the transfer parts of each of the transfer units are connected to the device surface of corresponding micro device. The area of each of the transfer surfaces is smaller than the area of the device surface of the corresponding micro device. A micro device structure using the carrier structure is also provided.