Micro Device Transfer Using Detachable Plates and Alignment Assistive Mechanisms
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Solution Overview
Problem
Traditional device transfer methods face challenges in efficiently transferring millions of micro devices for commercial applications, particularly in reducing costs and improving time efficiency while maintaining yield.
Innovation Solution
A method and system utilizing a detachable transfer plate and alignment assistive mechanisms to pick up and transfer micro devices from a carrier substrate to a receiving substrate, with a transfer head stocker for storage and distribution, enhancing throughput and flexibility by using a smaller, lighter, and simpler detachable transfer plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional wafer bonding or indirect bonding methods are used to transfer micro devices, then device transfer capability is achieved, but transfer time is excessive and throughput is low
Solution Approach 1:
The system segments the transfer process by using a transfer head with multiple independently controllable transfer plates, allowing different regions or devices to be transferred simultaneously or in parallel sequences, thereby increasing throughput without proportionally increasing total transfer time
Solution Approach 2:
The alignment assistive mechanism performs preliminary alignment of the transfer plate with the carrier substrate and receiving substrate before actual device transfer, ensuring that subsequent transfer operations can proceed rapidly without time-consuming real-time adjustments during the transfer process
2Manufacturing precision
If alignment assistive mechanisms are used to improve alignment precision, then manufacturing precision is improved, but device transfer time increases
Solution Approach 1:
The alignment assistive mechanism establishes alignment marks and performs preliminary positioning before device transfer, creating a pre-aligned state that enables rapid subsequent transfers without repeated alignment operations, thus achieving high precision without proportional time increase
Solution Approach 2:
The system uses alignment marks that are copied or replicated on both the carrier substrate and receiving substrate, allowing the alignment assistive mechanism to quickly match positions by detecting these reference patterns rather than performing complex measurements during transfer
3Adaptability or versatility
If a fixed transfer system is used for device transfer, then structural stability is maintained, but adaptability to different device types is reduced
Solution Approach 1:
The transfer plate is designed with movable and adjustable components that can dynamically adapt to different device configurations, allowing the same transfer head to handle multiple device types by reconfiguring the transfer plate position, orientation, or attachment method without replacing entire transfer systems
Solution Approach 2:
The transfer head and transfer plate are designed as universal components capable of transferring different types of micro devices through programmable control and reconfigurable positioning, eliminating the need for dedicated transfer systems for each device type while maintaining operational simplicity through standardized interfaces
Data Source
AI summary
A method of transferring micro devices includes: aligning a detachable transfer plate by an alignment assistive mechanism; picking up the micro devices and detaching the detachable transfer plate from the alignment assistive mechanism; placing the detachable transfer plate with the micro devices thereon into a transfer head stocker capable of storing multiple detachable transfer plates; moving the transfer head stocker to a place near an another alignment assistive mechanism; disassembling the detachable transfer plate with the micro devices thereon from the transfer head stocker; moving the detachable transfer plate with the micro devices thereon to be assembled to another alignment assistive mechanism above a receiving substrate to form a device transfer assembly; aligning the micro devices on the detachable transfer plate with the receiving substrate; and transferring the micro devices to the receiving substrate by the another alignment assistive mechanism through the detachable transfer plate.