Micro Device Transfer via Detachable Plates and Vertical Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional methods for transferring micro devices, such as wafer bonding, face challenges in cost reduction, time efficiency, and yield, especially when dealing with large-scale commercial applications involving millions of devices.
Innovation Solution
A method involving detachable transfer plates with micro devices is used, where each plate is aligned and transferred to a receiving substrate with an alignment assistive mechanism, allowing for efficient transfer of different types of micro devices without the need for extensive horizontal movement of the alignment mechanism, utilizing UV-curable glue layers and capillary forces for precise placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional wafer bonding methods are used for transferring micro devices, then the transfer process can be completed, but the throughput is low and alignment time is long due to extensive horizontal movement of the alignment mechanism
Solution Approach 1:
The patent transitions from horizontal transfer to vertical transfer by positioning the transfer plate above the receiving substrate. The alignment assistive mechanism moves vertically to align micro devices with pixel positions, eliminating the need for extensive horizontal movement and significantly reducing alignment time while increasing throughput
Solution Approach 2:
The patent introduces a detachable transfer plate as an intermediary carrier that holds multiple micro devices. This transfer plate can be quickly exchanged between different micro device types, eliminating the need for the alignment mechanism to extensively move horizontally to swap device types, thus improving throughput and reducing alignment time
2Adaptability or versatility
If different types of micro devices are transferred using traditional methods, then the transfer can be completed, but the process requires extensive horizontal movement of the alignment mechanism, reducing efficiency
Solution Approach 1:
The patent segments the transfer process by using separate detachable transfer plates for different micro device types. Each transfer plate is dedicated to a specific device type, allowing rapid exchange without extensive horizontal movement, thus maintaining versatility while improving transfer efficiency
Solution Approach 2:
The patent makes the transfer plate detachable and exchangeable, introducing dynamic flexibility to the system. This allows the system to adapt to different micro device types by simply swapping plates rather than moving the alignment mechanism extensively, improving both versatility and productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances throughput and reduces alignment time by minimizing the distance the alignment assistive mechanism needs to move, allowing for accurate and efficient transfer of various micro devices to the receiving substrate.
Implementation Method 1
utilizing UV-curable glue layers and capillary forces for precise placement
Implementation Method 2
utilizing UV-curable glue layers and capillary forces for precise placement
Data Source
AI summary
A method of transferring different types of micro devices is provided. The method includes: assembling a first detachable transfer plate with first type micro devices thereon to an alignment assistive mechanism which is substantially above a receiving substrate, wherein the first type micro devices face the receiving substrate; aligning the first type micro devices on the first detachable transfer plate with positions of first sub-pixels respectively of pixels on the receiving substrate by the alignment assistive mechanism; transferring the first type micro devices to the first sub-pixels on the receiving substrate; replacing the first detachable transfer plate with a second detachable transfer plate with second type micro devices thereon, wherein the second type micro devices face the receiving substrate; and transferring the second type micro devices to second sub-pixels respectively of the pixels on the receiving substrate.