Micro Device Transfer via Electric Field Alignment
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Solution Overview
Problem
Current micro LED transfer methods face challenges in achieving high alignment accuracy due to alignment shifts during the transfer process, leading to errors in the transfer of micro devices from a carrier substrate to a receiving substrate.
Innovation Solution
Applying different voltages to adjacent electrodes on the carrier and receiving substrates creates a specific electric field that guides micro devices for precise transfer, improving alignment accuracy and reducing transfer errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a transfer transmission head is used to transfer micro LEDs from carrier substrate to receiving substrate, then the transfer process can be completed, but alignment shifts occur during transfer causing poor alignment accuracy
Solution Approach 1:
The patent replaces the mechanical transfer transmission head system with an electric field-based transfer system. Voltage is applied to electrodes on the carrier substrate and receiving substrate to generate electric fields that guide and control the transfer of micro LEDs, eliminating mechanical alignment issues and achieving higher alignment accuracy without physical contact during transfer
Solution Approach 2:
The patent changes the control parameter from mechanical position control to electrical voltage control. By adjusting voltage parameters applied to different electrodes, the transfer process is controlled with higher precision, enabling accurate positioning of micro LEDs on the receiving substrate while maintaining process stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances alignment accuracy during micro device transfer, minimizing errors and achieving high precision in the transfer process by utilizing electric fields generated from voltage differences between electrodes.
Implementation Method 1
Applying different voltages to adjacent electrodes on the carrier and receiving substrates creates a specific electric field that guides micro devices for precise transfer
Data Source
AI summary
A method of transferring micro devices is provided. A carrier substrate including a plurality of first electrodes and a plurality of micro devices is provided. The micro devices are separated from each other and respectively electrically connected to the first electrodes. A receiving substrate is made to relatively close to the carrier substrate. The receiving substrate includes a plurality of second electrodes, and the second electrodes and the first electrodes are opposite in electrical property. A first voltage and a second voltage are applied to a portion of the adjacent two first electrodes, so that the micro devices are released from the carrier substrate to the receiving substrate and bonded to the receiving substrate. The first voltage is different from the second voltage. In addition, a micro devices transfer apparatus is also provided.