Micro Device Fixing Structure for High-Yield Display Transfer
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Solution Overview
Problem
Miniaturized electronic devices face challenges in efficient transfer during manufacturing and application due to limitations in pick-up speed and yield, as existing methods do not effectively address the need for precise handling and bonding to circuit boards.
Innovation Solution
A micro device structure with a fixed structure that includes a connecting portion and a turning portion, extending from the upper surface to the side surface, allowing for efficient transfer by reducing stress and preventing electrode misalignment during bonding, thereby improving transfer speed and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If miniaturized electronic devices are used, then device volume is reduced, but transfer efficiency and yield during manufacturing decrease
Solution Approach 1:
The fixing structure is divided into multiple functional portions: a connecting portion that bonds to the device, a first turning portion that provides stress relief, and a second turning portion that enables controlled release. This segmentation allows the structure to handle miniaturized devices effectively while maintaining transfer efficiency through precise mechanical control at each segment.
Solution Approach 2:
The fixing structure acts as an intermediary between the miniaturized device and the transfer/bonding system. The connecting portion interfaces with the device, while the turning portions interface with the transfer mechanism, mediating the transfer process to improve yield and efficiency despite the device's small size.
2Productivity
If transfer speed is increased, then productivity improves, but stress-induced damage and electrode misalignment increase
Solution Approach 1:
The first turning portion is designed beforehand to provide stress relief during the transfer process. This cushioning structure absorbs mechanical stresses that would otherwise damage miniaturized devices during high-speed transfer, allowing faster transfer speeds without compromising device integrity or electrode alignment.
Solution Approach 2:
The fixing structure incorporates dynamic elements through the turning portions that can flex and rotate. This dynamic capability allows the structure to adapt to variations in transfer speed and positioning, maintaining reliability by absorbing shocks and preventing misalignment even during high-speed operations.
3Manufacturing precision
If fixing structure extends from upper surface to side surface, then transfer precision improves, but device complexity increases
Solution Approach 1:
The fixing structure extends from the upper surface onto the side surface of the device, utilizing a third dimension to improve transfer precision. This multi-dimensional configuration provides additional bonding contact points and mechanical stability without requiring complex internal structures, thereby achieving high precision while controlling overall complexity.
Data Source
AI summary
A micro device structure including a device and a fixed structure is provided. The device has an upper surface, a lower surface, and a first side surface. The lower surface is opposite to the upper surface. The first side surface connects the upper surface and the lower surface. The fixing structure includes a connecting portion and a first turning portion. The connecting portion extends at least from the upper surface of the device to the first side surface. The first turning portion is in contact to be connected with a first end of the connecting portion and extends outward from the first side surface to be away from the first side surface. The first end of the connecting portion is located on the first side surface between the upper surface and the lower surface. A display apparatus is also provided.