Micro-Display LED Chip Layout for Brighter Dense Pixel Arrays
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Solution Overview
Problem
Micro-LED chip structures in existing technologies have a small light-emitting region area, limiting their brightness and efficiency in micro-display applications such as AR, VR, and HUD.
Innovation Solution
A micro-display LED chip structure with a substrate and an LED semiconductor layer, where each LED unit is independently driven by a driving circuit with contacts located in the orthographic projection region, and a step structure or isolation material layer ensures electrical isolation between adjacent units, increasing the light-emitting region area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If contacts are disposed between adjacent LED units, then electrical connection and driving are achieved, but the light-emitting region area is reduced
Solution Approach 1:
The contact structure transitions from a planar arrangement (between LED units) to a three-dimensional arrangement (within the thickness direction of the LED semiconductor layer). By placing contacts inside the LED semiconductor layer and connecting them to electrode layers on both surfaces, the patent eliminates the need for lateral contact spacing, thereby maximizing the light-emitting region area while maintaining electrical connection functionality.
2Area of stationary object
If LED units are arranged closely to increase light-emitting area, then brightness is improved, but electrical isolation between adjacent units becomes difficult
Solution Approach 1:
The LED semiconductor layer is divided into multiple independently controllable LED units through internal segmentation structures. Each LED unit contains its own active layer, doping layers, and contact connections, allowing electrical isolation between units while maintaining close physical spacing. This segmentation enables each unit to be driven independently without electrical interference from adjacent units.
Solution Approach 2:
Electrical isolation is achieved by utilizing the thickness direction (vertical dimension) of the LED semiconductor layer rather than relying on lateral spacing. By implementing isolation structures such as undoped semiconductor layers or insulating layers in the vertical direction between adjacent LED units, the patent enables close packing of units in the planar direction while maintaining reliable electrical isolation.
3Productivity
If batch transfer technology is used to manufacture micro-LED arrays, then manufacturing capability is achieved, but process complexity and yield issues arise
Solution Approach 1:
The patent implements preliminary action by pre-forming complete LED units with all necessary structures (semiconductor layers, doping regions, contacts, and isolation layers) directly on the substrate in their final positions. This eliminates the need for subsequent batch transfer operations, as the LED units are already manufactured in their definitive locations, thereby simplifying the overall manufacturing process and improving yield.
Solution Approach 2:
The patent extracts the batch transfer step from the manufacturing process entirely. By adopting a direct formation approach where LED units are created in-situ on the substrate using semiconductor fabrication techniques, the complex batch transfer technology is removed from the process flow, reducing both process complexity and associated yield challenges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the light-emitting brightness and efficiency of micro-display LED chips by reducing the distance between LED units and increasing the light-emitting region area, improving integration and yield without the need for batch transfer technology.
Implementation Method 1
A display having micro-sized Light-Emitting Diodes (LEDs) is referred to as micro-LEDs
Implementation Method 2
The LED semiconductor layer includes a plurality of LED units arranged in an array
Data Source
AI summary
A micro-display LED chip structure includes: a first substrate; and an LED semiconductor layer disposed on the first substrate. The LED semiconductor layer includes a plurality of LED units arranged in an array, and adjacent LED units are capable of being driven independently. The first substrate includes a driving circuit, the driving circuit is provided with a plurality of contacts, each contact of the plurality of contacts corresponds to an LED unit, the contact is located in an orthographic projection region, on the first substrate, of the LED unit corresponding to the contact, and the contact is electrically connected to the LED unit. The micro-display LED chip structure according to embodiments of the present disclosure may reduce a distance between two adjacent LED units, and improve an area of a light-emitting region of the LED unit, thereby improving a light-emitting brightness of the micro-display LED chip structure.