Micro Semiconductor Display Transfer Structure for Clean Electrode Contact
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Solution Overview
Problem
Micro light-emitting diodes face issues with poor electrode contact and performance due to residual fixing structures after transfer to a receiving substrate, leading to decreased efficiency and reliability.
Innovation Solution
A semiconductor structure with a fixing structure comprising conductive and supporting layers of different materials, where the conductive layers are on the lower surfaces of micro semiconductor devices and the supporting layers are connected to the substrate, allowing for easier separation and preventing residual fixing structures, thus enhancing electrode contact and device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a fixing structure is used to hold the micro light-emitting diode during transfer, then the micro light-emitting diode is easier to pick up and transfer, but the fixing structure may remain after transfer, resulting in poor electrode contact
Solution Approach 1:
The fixing structure is divided into multiple layers including a first fixing layer and a second fixing layer with different materials and functions. The first fixing layer provides initial attachment while the second fixing layer facilitates controlled release, allowing segmentation of the fixing function to resolve the contradiction between easy transfer and clean release.
Solution Approach 2:
The patent changes the material parameters of the fixing structure layers, using a first fixing layer made of a material with strong adhesion to the micro LED and a second fixing layer made of a material that allows controlled release. This parameter change enables the structure to provide both strong holding during transfer and clean release afterward, resolving the electrode contact issue.
2Strength
If the fixing structure is used to consolidate the micro light-emitting diode, then the quality is protected during transfer, but the fixing structure remains after transfer, decreasing device performance
Solution Approach 1:
The patent designs the fixing structure to be extractable after serving its protective function during transfer. The layered structure with different adhesion properties allows the fixing layers to be selectively removed or released after transfer, taking out the protective function when no longer needed and preventing it from interfering with device performance.
Solution Approach 2:
By changing the material parameters of the fixing layers, the patent enables the structure to provide strong consolidation during transfer then allow clean release afterward. The first fixing layer with strong adhesion provides protection, while the second fixing layer with different adhesion characteristics enables release, resolving the contradiction between protection and performance.
3Ease of operation
If a fixing structure is used to hold the micro light-emitting diode, then the micro light-emitting diode is easier to handle, but the fixing structure interferes with electrode contact after transfer
Solution Approach 1:
The fixing structure is segmented into multiple functional layers that can be selectively applied and removed. This segmentation allows the structure to provide handling assistance when needed while being removable to prevent interference with precise electrode contact requirements after transfer.
Solution Approach 2:
The patent uses material parameter changes in the fixing layers to enable easy handling during transfer then clean release for precise electrode contact. The different adhesion parameters of the first and second fixing layers allow controlled attachment and release, resolving the contradiction between ease of handling and manufacturing precision.
Data Source
AI summary
A semiconductor structure includes a substrate, a plurality of micro semiconductor devices and a fixing structure. The micro semiconductor devices are disposed on the substrate. The fixing structure is disposed between the substrate and the micro semiconductor devices. The fixing structure includes a plurality of conductive layers and a plurality of supporting layers. The conductive layers are disposed on the lower surfaces of the micro semiconductor devices. The supporting layers are connected to the conductive layers and the substrate. The material of each of the conductive layers is different from the material of each of the supporting layers.