Micro Element Confinement Structure for Solder Overflow Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The issue of short circuits in micro element structures due to solder material overflow during the reflow process is prevalent, particularly for extremely small-sized components.
Innovation Solution
A micro element structure design featuring a body, electrodes, solder patterns, and a confinement structure that surrounds the electrodes and solder patterns, with a gap between the confinement structure and the solder patterns to limit overflow and prevent short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the micro element structure is made extremely small-sized, then the integration density and device miniaturization are improved, but the solder material is more likely to overflow during reflow process causing short circuits
Solution Approach 1:
The patent introduces a confinement structure that divides the soldering area into a confined interior region and an exterior region. This segmentation isolates the solder material within the confinement structure during reflow, preventing overflow to adjacent electrodes or circuits while maintaining the miniaturized size of the micro element structure.
Solution Approach 2:
The confinement structure acts as an intermediary barrier between the solder material and surrounding electrodes/circuits. During the reflow process, this intermediate structure contains the molten solder within its interior region, preventing direct contact between solder and other conductive elements, thus eliminating the short circuit risk associated with miniaturized designs.
2Reliability
If the confinement structure is placed close to the solder pattern, then the confinement effect is improved, but the gap between confinement structure and solder pattern becomes too small to effectively contain overflow
Solution Approach 1:
The confinement structure is designed with a protrusion height that extends above the solder pattern before reflow occurs. This preliminary geometric configuration ensures that when solder melts and attempts to overflow, the confinement structure's elevated walls already exist to contain it, preventing the need for large gaps while maintaining effective confinement.
Solution Approach 2:
The confinement structure utilizes the vertical dimension by protruding above the plane of the solder pattern with a specific height. This vertical extension creates an enclosed interior region that contains solder in the horizontal plane while the vertical walls prevent overflow, effectively solving the contradiction between gap size and confinement effectiveness through dimensional transition.
Data Source
AI summary
A micro element structure including a body, two electrodes, two solder patterns and a confinement structure is provided. The two electrodes are disposed on a side of the body. The two solder patterns are disposed on the two electrodes, respectively. The confinement structure protrudes relative to the body, wherein the confinement structure surrounds one of the electrodes and the solder pattern thereon, and at least a portion of the confinement structure is separated from the surrounded solder pattern with a gap. A display device is also provided.