Micro-Element Transposition with Elastic Suction Head
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Solution Overview
Problem
Existing micro-element transposition technologies often damage micro-elements due to the use of rigid vacuum suction heads and can result in imperfect electrical contact or solder cracks, especially in the context of increasingly lightweight and thin electronic devices.
Innovation Solution
The use of an electronic component with a connecting electrode featuring a first transparent conductive layer having micrometers or nanometer particles, combined with an elastic suction head and pump part in a transposing component, allows for the safe lifting, placement, and fixation of micro-elements using a solder, ensuring secure attachment and minimizing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid vacuum suction head is used to grasp a micro-element, then the micro-element can be held and moved, but the suction head easily hits the micro-element and causes damage
Solution Approach 1:
The patent replaces the rigid vacuum suction head with a flexible suction head that can deform elastically. This flexible structure conforms to the contour of the micro-element being grasped, distributing the suction force evenly and avoiding concentrated stress points that would cause damage. The flexibility allows the suction head to adapt to different micro-element shapes and sizes while maintaining secure grasping.
Solution Approach 2:
The patent changes the physical state of the suction head from rigid to flexible by selecting materials with appropriate elastic properties. This parameter change enables the suction head to deform under vacuum pressure and contact forces, thereby protecting the micro-element from mechanical damage while maintaining effective grasping capability.
2Manufacturing precision
If a rigid vacuum suction head is used, then grasping is effective, but uneven pressure causes displacement of micro-element or imperfect electrical contact
Solution Approach 1:
The flexible suction head deforms to match the micro-element's surface contour, creating uniform pressure distribution across the contact area. This even pressure distribution prevents micro-element displacement and ensures perfect electrical contact between the micro-element and the connecting electrode, while still maintaining effective grasping through vacuum suction.
3Reliability
If a rigid vacuum suction head is used, then the micro-element can be moved, but uneven pulling force causes cracks in solder
Solution Approach 1:
The flexible suction head maintains constant contact with the micro-element during the transposition process. When removing the suction head, its flexibility allows it to release the micro-element uniformly without creating concentrated pulling forces that would crack the solder joints. This enables reliable transposition while protecting the integrity of the solder connections.
4Strength
If the contact area between micro-element and connecting electrode is increased, then attachment force is improved, but the complexity of the connecting electrode structure increases
Solution Approach 1:
The connecting electrode is designed with a porous structure containing multiple cavities. When solder is applied, it fills these cavities and forms extensive contact areas with the micro-element. This porous structure dramatically increases the attachment force and contact area without significantly increasing the external dimensions or visual complexity of the electrode, as the complexity is internal rather than external.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the contact area and attachment force between the micro-element and the connecting electrode, reducing the risk of damage and ensuring reliable electrical connections while preventing solder cracks during the transposition process.
Implementation Method 1
a transposing component comprising an elastic suction head and a pump part, wherein a surface of the elastic suction head has at least one projection, the elastic suction head has at least one through hole, and the through hole passes through one of the at least one projection via the surface of the elastic suction head to penetrate the other surface of the elastic suction head
Implementation Method 2
driving a pump part to introduce a gas to a through hole, and separating the micro-element from an elastic suction head in the process of introducing the gas
Implementation Method 3
The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode
Data Source
AI summary
An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometers or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.