Micro-Fluidic Jet Impingement Cooling in Chip Packages
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Solution Overview
Problem
Conventional thermal management systems are inadequate for efficiently cooling high-power electronic devices, such as GaN microwave amplifiers, due to increased heat flux and power densities, which limits their performance.
Innovation Solution
Integration of micro-fluidic jet impingement cooling within electronic chip packages, utilizing a dielectric substrate with impingement openings for pressurized fluid to directly cool heat-generating components, reducing thermal resistance by eliminating intermediate materials and enhancing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional remote cooling systems with multiple intermediate material layers are used, then device packaging and assembly are simplified, but thermal resistance increases and cooling effectiveness decreases
Solution Approach 1:
The patent removes intermediate material layers (solder, epoxy, ceramic) between the heat-generating device and the coolant, extracting the thermal resistance elements from the heat transfer path. This leaves only essential structural layers, dramatically reducing thermal resistance while maintaining packaging simplicity.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the device, acts as a thermal management component by containing the coolant reservoir and cooling channels, and enables direct thermal coupling between the device and coolant. This multi-functionality eliminates the need for separate cooling components, reducing system complexity.
2Ease of manufacture
If multiple intermediate material layers are used in cooling systems, then device assembly is easier, but heat transfer efficiency deteriorates
Solution Approach 1:
The patent extracts non-essential intermediate material layers that contribute thermal resistance. The substrate is designed to contain only the necessary structural and cooling functions, removing solder layers, epoxy layers, and ceramic layers that impede heat transfer while maintaining ease of assembly through integrated manufacturing.
Solution Approach 2:
The patent changes the thermal parameter of the cooling system by reducing the number and thickness of intermediate layers. This parameter change dramatically improves heat transfer efficiency while the substrate's integrated design maintains manufacturing simplicity through standardized fabrication processes.
3Device complexity
If conventional cooling techniques are used, then system design is straightforward, but cooling capability is insufficient for high power densities
Solution Approach 1:
The patent employs liquid coolant flowing through channels in the substrate to remove heat from the device. This hydraulic cooling approach provides superior heat dissipation capability compared to air cooling or conventional heat sinks, enabling the system to handle high power densities while maintaining relatively simple design through the substrate's integrated cooling channels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces thermal resistance, allowing for lower operating temperatures or increased heat dissipation, thereby improving the performance and efficiency of high-power electronic devices.
Implementation Method 1
A plurality of impingement openings are formed through the body, with each impingement opening configured to be responsive to a source of pressurized fluid for generating a fluid stream to be expelled in a direction of the electronic device
Data Source
AI summary
An electronic chip package includes a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.