Micro LED Display Alignment via Intermediary Marks

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current micro light-emitting diode display apparatuses face low manufacturing yield due to alignment errors during the transfer of small LED elements, leading to improper placement and non-functional LED elements.

Innovation Solution

A display apparatus design featuring a driving substrate with specific pad configurations, connection elements, insulation patterns, and reflective patterns that facilitate accurate placement and repair of LED elements, including the use of adhesive patterns and insulation layers to ensure proper electrical connections and alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mass transfer of micro LED elements is performed using current manufacturing processes, then production scale can be achieved, but alignment precision deteriorates due to the small size of LED elements

Engineering Contradiction:
Improveproduction scaleVSAvoidalignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent introduces alignment marks as intermediary reference features on both the donor substrate and transfer substrate. These alignment marks serve as mediators that enable precise positioning of micro LED elements during mass transfer, resolving the contradiction between achieving production scale and maintaining alignment precision by providing a reference framework that guides the transfer process

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent performs preliminary alignment mark formation and positioning before the actual LED element transfer process. By pre-establishing the alignment reference system on both substrates, the method enables subsequent mass transfer to proceed with high precision, allowing production scale to be achieved without sacrificing alignment accuracy

Inventive Principle:
Principle #10Preliminary action

2Reliability

If micro LED elements are placed in predetermined positions, then display function can be achieved, but manufacturing yield deteriorates due to alignment errors

Engineering Contradiction:
Improvedisplay functionVSAvoidmanufacturing yield
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent implements a feedback mechanism through the alignment mark system that provides real-time positioning information during the transfer process. The alignment marks enable the transfer system to detect and correct positioning deviations, ensuring LED elements are placed accurately in predetermined positions while maintaining high manufacturing yield by reducing placement errors

Inventive Principle:
Principle #23Feedback

3Manufacturing precision

If alignment marks are formed on substrates, then positioning precision can be improved, but device complexity increases

Engineering Contradiction:
Improvepositioning precisionVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies alignment marks only at specific critical locations on the substrates where positioning is needed, rather than covering the entire surface. This localized approach provides sufficient positioning precision for LED element placement while minimizing the added structural complexity to essential elements only

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11664358B2Display apparatus
Publication Date: 2023.05.30 AU OPTRONICS CORP
  • US11664358B2 patent drawing
  • US11664358B2 patent drawing
  • US11664358B2 patent drawing

AI summary

A display apparatus includes a driving substrate, a first light-emitting diode element, a first connection element, a second connection element, a first insulation pattern, and a reflective pattern. The driving substrate has a first pad, a second pad, a third pad, and a connection area. The first connection element is electrically connected to a first electrode of the first light-emitting diode element and the first pad of the driving substrate. The second connection element is electrically connected to a second electrode of the first light-emitting diode element and the second pad of the driving substrate. The first insulation pattern is disposed on the first light-emitting diode element, the first connection element, and the second connection element. The reflective pattern is disposed on the first insulation pattern.