Micro LED Backplane Bonding Layer Alignment
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Solution Overview
Problem
The manufacturing process of driving backplanes for Micro LED display devices is complex, leading to high costs and suboptimal power consumption due to pattern misalignment and separate mask processes for conductive protection and bonding metal layers.
Innovation Solution
A driving backplane design where a bonding layer comprising a stacked bonding metal layer and conductive protection layer, both formed in a single mask process, ensures alignment and reduced contact resistance, with additional layers like TFT, trace, and insulating layers optimizing the structure for efficient Micro LED bonding and power management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate mask processes are used for conductive protection layer and bonding metal layer, then each layer can be formed independently, but manufacturing complexity increases and alignment errors occur
Solution Approach 1:
The patent combines the formation of the conductive protection layer and bonding metal layer into a single mask process. The mask layer patterns both layers simultaneously, ensuring precise alignment between them while reducing the number of separate manufacturing steps. This merging approach eliminates alignment errors that would occur with separate mask processes and simplifies the overall manufacturing process.
2Ease of manufacture
If stacked bonding metal layer and conductive protection layer are formed in single mask process, then manufacturing process is simplified and alignment is improved, but contact resistance must be minimized
Solution Approach 1:
The patent applies local quality by creating a protruded pattern layer with specific geometric features (protrusions) at the bonding interface. These protrusions increase the local contact area between the bonding metal layer and Micro LED electrodes, thereby reducing contact resistance locally at critical bonding points while maintaining the overall simplified stacked structure formed in a single mask process.
3Reliability
If protruded pattern layer is added to maximize contact area, then bonding reliability improves and contact resistance reduces, but device structure becomes more complex
Solution Approach 1:
The protruded pattern layer is integrated into the existing mask-based manufacturing process. The same mask layer that defines the bonding metal and conductive protection layers also defines the protruded pattern geometry. This merging of pattern definition functions allows the protrusions to be formed without adding separate manufacturing steps, thereby improving bonding reliability through increased contact area while minimizing the increase in overall device structural complexity.
Data Source
AI summary
The present disclosure provides a driving backplane, a method for manufacturing the same, and a display device. The driving backplane includes: a substrate; and a bonding layer located on a side of the substrate and configured to bond with a plurality of Micro LEDs arranged in an array, wherein the bonding layer comprises a bonding metal layer and a conductive protection layer that are stacked sequentially along a direction away from the substrate, an orthographic projection of the conductive protection layer on the substrate substantially coinciding with an orthographic projection of the bonding metal layer on the substrate.