Micro-LED Display Bank Film Patterning for Resolution and Crack Control
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Solution Overview
Problem
Current micro-LED display manufacturing processes face challenges in reducing production time, increasing yield, lowering costs, minimizing crack propagation, and reducing the boundary area between micro LEDs, which affects the display's resolution and user perception.
Innovation Solution
A manufacturing method involving the formation of thin-film transistor arrays and micro-LED arrays on separate substrates, followed by transferring and patterning to create pixel arrays, with bank layers to minimize boundary areas and crack propagation, and optimizing substrate cutting to reduce defects and improve resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro LEDs are transferred individually, then manufacturing precision is improved, but productivity is reduced
Solution Approach 1:
The patent divides the substrate into multiple arrays, each containing multiple micro-LEDs. Instead of transferring individual micro-LEDs, entire arrays are transferred together in batches. This segmentation approach maintains precision through controlled array transfer while dramatically improving productivity by processing multiple LEDs simultaneously rather than individually.
2Manufacturing precision
If boundary area between micro LEDs is reduced, then manufacturing precision is improved, but crack propagation risk increases
Solution Approach 1:
The patent applies a bank film to the substrate before transferring the micro-LED arrays. This preliminary action creates a protective layer that reduces crack propagation during the transfer process. The bank film is strategically positioned to protect vulnerable areas while allowing the boundary areas between micro-LEDs to be minimized for high-resolution display.
3Productivity
If production time is reduced, then productivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple micro-LEDs into arrays that are transferred together as single units. This merging of transfer operations reduces production time significantly compared to individual transfers. The process complexity is managed through systematic array design and coordinated transfer mechanisms, making the complex process manageable and efficient.
Data Source
AI summary
A manufacturing method of a micro-LED display device comprises forming a plurality of thin-film transistor array areas that includes a plurality of thin-film transistor arrays on a first substrate; forming a plurality of micro-LED array areas that includes a plurality of micro-LED arrays on a second substrate; transferring the plurality of micro-LED array areas that correspond to the plurality of thin-film transistor array areas onto the first substrate; forming a bank film on a third substrate over the first substrate; patterning the bank film to form a first bank layer that corresponds to a boundary area between the plurality of micro-LED arrays and a second bank layer that corresponds to an edge area of the plurality of micro-LED array areas, to form a pixel area and a pixel array area, and to remove the bank film in a boundary area between the second bank layers adjacent to each other; cutting the third substrate and the first substrate along a scribe zone that is set in a boundary area between the second bank layers adjacent to each other; and separating a plurality of pixel arrays that includes the plurality of thin-film transistor arrays and the plurality of micro-LED arrays from the first substrate and transferring the plurality of pixel arrays onto a fourth substrate.