Micro LED Array Substrate Transfer via Batch Color Segmentation

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Solution Overview

Problem

Current methods for manufacturing micro light-emitting diode array substrates face challenges in efficiency and scalability, particularly in producing large-sized full-color displays, as existing technologies require precise handling of tiny diodes and struggle to achieve high luminous efficiency and control over color pixel arrays.

Innovation Solution

A method involving a drive substrate with sub-pixel regions for different colors, where micro light-emitting diodes of varying thicknesses are formed on a base substrate and transferred en masse onto the drive substrate in a sequence that increases epitaxial layer thickness, allowing for efficient formation of colored pixel arrays and full-color displays.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If micro light-emitting diodes are transferred one by one using precise handling, then positioning accuracy is improved, but transfer efficiency deteriorates

Engineering Contradiction:
Improvepositioning accuracyVSAvoidtransfer efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges multiple individual transfer operations into a single batch transfer operation. Micro light-emitting diodes of the same color are transferred together as a group from the base substrate to the drive substrate, maintaining positioning accuracy while dramatically improving transfer efficiency compared to individual handling.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent segments the transfer process by color groups. Different color micro LEDs (red, green, blue) are transferred in separate batch operations, allowing each color group to be handled as a unified unit. This segmentation enables efficient batch processing while maintaining the precision needed for different color placements.

Inventive Principle:
Principle #1Segmentation

2Productivity

If micro light-emitting diodes of different colors are transferred simultaneously, then productivity is improved, but manufacturing precision deteriorates

Engineering Contradiction:
Improvetransfer efficiencyVSAvoidcolor pixel array control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent divides the micro LEDs into separate color groups (red, green, blue) and transfers each color group in distinct batch operations. This segmentation by color ensures that each pixel type is precisely placed in its correct location on the drive substrate, maintaining color pixel array control while achieving efficient batch transfer for each color group.

Inventive Principle:
Principle #1Segmentation

3Device complexity

If conventional manufacturing methods are used, then device complexity is reduced, but scalability to large-sized displays deteriorates

Engineering Contradiction:
Improveprocess simplicityVSAvoidscalability
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent combines multiple transfer operations into a single batch transfer process, significantly improving scalability to large-sized displays. By transferring micro LEDs of the same color as a group rather than individually, the method maintains process simplicity while enabling efficient manufacturing of large-area Micro-LED displays.

Inventive Principle:
Principle #5Merging (Combining)

4Loss of energy

If micro light-emitting diodes with varying epitaxial layer thicknesses are transferred, then luminous efficiency is improved, but device complexity increases

Engineering Contradiction:
Improveluminous efficiencyVSAvoidtransfer sequence control
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent performs preliminary sorting of micro LEDs by epitaxial layer thickness before the transfer process. By pre-grouping LEDs according to their thickness characteristics, the transfer process becomes more straightforward while still achieving the luminous efficiency benefits of thickness-optimized placement. This preliminary action reduces the complexity of real-time thickness control during transfer.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS10964855B2Method for manufacturing micro light-emitting diode array substrate
Publication Date: 2021.03.30 BEIJING BOE OPTOELECTRONCIS TECH CO LTD
  • US10964855B2 patent drawing
  • US10964855B2 patent drawing
  • US10964855B2 patent drawing

AI summary

A method for manufacturing a micro light-emitting diode array substrate is disclosed. The method includes: providing a drive substrate comprising a plurality of sub-pixel regions, the plurality of sub-pixel regions being configured for bearing micro light-emitting diodes of different colors, and epitaxial layers of the micro light-emitting diodes of different colors having different thicknesses; providing a base substrate, forming a plurality of micro light-emitting diodes on the base substrate, and transferring micro light-emitting diodes of same color on the base substrate as a whole onto the drive substrate; repeating the transferring process in a sequence that the thicknesses of the epitaxial layers of the micro light-emitting diodes gradually increase, until each sub-pixel region in pixel units is provided with one of the micro light-emitting diodes having same color as the each sub-pixel region.