Micro LED Display Substrate Layout to Prevent Bend Wire Disconnection
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Solution Overview
Problem
Micro LED display devices face issues with side wire disconnection during bending due to separate upper and lower substrates, leading to product defects and increased manufacturing complexity, and require additional processes for signal transmission and substrate manufacturing.
Innovation Solution
A micro LED display device design using a single substrate with a front panel region, a rear panel region, and a bending region, where connection wires and side wires are integrated to prevent disconnection and eliminate the need for separate substrate manufacturing, allowing for flexible and lightweight display designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate upper and lower substrates are used for micro LED display devices, then the display device can be manufactured with modular components, but side wires may disconnect during bending leading to product defects
Solution Approach 1:
The patent combines the upper substrate and lower substrate into a single integrated substrate structure. The front panel region, bending region, and rear panel region are formed as one continuous substrate that supports both the light emitting elements and the integrated circuit chip, eliminating the interface between separate substrates and preventing side wire disconnection during bending.
2Ease of operation
If separate upper and lower substrates are used with side wires for electrical connection, then signal transmission between components is enabled, but additional manufacturing processes and complexity are required
Solution Approach 1:
The patent merges the electrical connection function into the single substrate structure. Connection wires are formed directly on the substrate to electrically connect the light emitting elements in the front panel region with the integrated circuit chip in the rear panel region, eliminating the need for separate side wire bonding processes between distinct substrates.
3Adaptability or versatility
If multiple separate substrates are manufactured and assembled, then functional modules can be independently produced, but manufacturing costs and process time increase
Solution Approach 1:
The patent consolidates the manufacturing process by forming all functional components - light emitting elements, connection wires, and integrated circuit chip - on a single substrate. This eliminates the assembly steps required to join multiple substrates together, thereby improving manufacturing efficiency and productivity.
4Strength
If traditional substrate materials are used in display devices, then structural strength is maintained, but device weight increases
Solution Approach 1:
The patent changes the material parameter of the substrate by introducing a lightweight material that maintains sufficient structural strength while reducing the overall weight of the display device. This allows the single substrate structure to achieve both mechanical integrity and weight reduction.
Data Source
AI summary
Disclosed is a display device including a substrate comprising a front panel region, a rear panel region and a bending region disposed between the front panel region and the rear panel region; a display region located in the front panel region, a plurality of light emitting elements being disposed on the display region; an integrated circuit chip disposed on the rear panel region; and connection wires extending from the front panel region to the rear panel region of the substrate through the bending region, and the rear panel region of the substrate may be secured to a lower portion of the substrate that corresponds to the front panel region.