Micro LED Substrate Layout for Near Seamless Bezel-Less Tiling
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Solution Overview
Problem
Large displays manufactured by splicing smaller units often have significant bezel gaps, leading to reduced display quality and increased manufacturing costs due to non-display dark regions.
Innovation Solution
A micro light emitting diode (Micro LED) display substrate design featuring a thin film transistor (TFT) on the top surface and a fanout circuit pattern on the bottom surface, connected via a side wire, allowing for a bezel-less assembly with minimal splicing gaps, and simplifying the TFT structure by eliminating independent processes for passivation layer hole formation and ITO pixel electrode manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If displays are spliced to form large screens, then manufacturing cost per area is reduced, but splicing gaps create non-display dark regions that lower display quality
Solution Approach 1:
The invention moves the circuit layout from the top surface (display surface) to the bottom surface of the substrate. By placing the fanout circuit pattern and bonding pads on the bottom surface, the display pixels can extend to the edges of the substrate, eliminating the need for bezels and reducing splicing gaps when multiple displays are assembled together.
2Device complexity
If circuit patterns are placed on the top surface of the substrate, then connection to display pixels is simplified, but the display region cannot extend to the substrate edges, creating bezel gaps
Solution Approach 1:
The invention relocates the circuit patterns (fanout circuit pattern and bonding pads) from the top surface to the bottom surface of the substrate. This allows the display pixel region to extend to all edges of the substrate top surface, maximizing the display area and eliminating bezel gaps while maintaining electrical connections through the substrate thickness.
3Manufacturing precision
If independent processes are used for passivation layer hole formation and ITO pixel electrode manufacturing, then manufacturing precision is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention combines the pixel electrode function with the source and drain metal electrode layers of the TFT. By integrating the Micro LED directly onto these metal layers and using the same metal patterns for both TFT interconnection and pixel electrode functions, the independent processes for passivation layer hole formation and ITO pixel electrode manufacturing are eliminated, reducing manufacturing complexity while maintaining precision.
Data Source
AI summary
The present invention discloses a micro light emitting diode display substrate and a manufacturing method thereof. The substrate includes an underlay substrate, a thin film transistor and a micro light emitting diode disposed on a top surface of the underlay substrate and connected to each other, a first metal film layer disposed on a bottom surface of the underlay substrate and at least formed with fanout circuit pattern and a side printed bonding pad. The fanout circuit pattern is connected to the side printed bonding pad, the side printed bonding pad is connected to the thin film transistor through a side wire such that after the display substrate is assembled with a bezel, a top surface display pixel region can maximally approach the bezel, to achieve bezel-less effect.