Micro LED Display Panel Repair via Photoresistor-Melted Binding Layer
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Solution Overview
Problem
In Micro LED display panel manufacturing, abnormal chips are difficult to remove without damaging the binding position, making it challenging to effectively fix newly provided normal light-emitting chips.
Innovation Solution
A display panel with a binding layer and a photoresistor on the drive backplane, where the photoresistor's increased resistance when the light-emitting chip is abnormal causes the binding layer to melt, allowing for the separation and replacement of abnormal chips without damaging the binding position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If high-energy laser irradiation is used to break and remove abnormal chips, then abnormal chips can be removed, but the metal at the binding position is damaged making it difficult to fix new chips
Solution Approach 1:
The patent introduces a photoresistor as an intermediary component between the abnormal chip and the binding layer. The photoresistor converts light energy to thermal energy, which then melts the binding layer material to release the abnormal chip. This intermediary mechanism avoids direct high-energy laser irradiation of the binding layer metal, preventing metal damage while achieving chip removal.
Solution Approach 2:
The patent changes the physical state of the binding layer material from solid to liquid (molten state) through controlled heating by the photoresistor. This parameter change (temperature increase) allows the binding layer to lose its binding function and release the abnormal chip, while the heating is localized and controlled to prevent damage to the underlying metal structure.
2Productivity
If high-energy laser irradiation is used to remove abnormal chips, then chips can be separated, but the binding position is damaged
Solution Approach 1:
The photoresistor serves as a localized intermediary that concentrates energy conversion at the chip-binding layer interface. This allows precise separation of the abnormal chip without spreading damage to the surrounding binding position, maintaining manufacturing precision while enabling efficient replacement.
Solution Approach 2:
The patent applies local quality by having the photoresistor positioned specifically at the abnormal chip location. The heating effect is localized to the binding layer beneath the photoresistor, creating a localized molten region that releases only the target chip while leaving the surrounding binding position intact for future repairs.
3Ease of repair
If the binding layer is melted to remove chips, then chips can be separated without metal damage, but the binding layer loses its fixing function
Solution Approach 1:
The patent utilizes phase transition of the binding layer material from solid to liquid (molten state) through controlled heating. This phase transition temporarily destroys the binding layer's structural stability to enable chip removal, but the binding layer can subsequently re-solidify and restore its fixing function for new chips, making the process reversible and non-damaging to the overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient removal and replacement of abnormal light-emitting chips, reducing damage to the binding layer and ensuring effective fixation of new chips, thereby improving the repair process in Micro LED display panels.
Implementation Method 1
the binding layer being configured to be in a molten state under an action of heat generated by the photoresistor when the light-emitting chip is in the abnormal state
Implementation Method 2
the binding layer being configured to be in a molten state under an action of heat generated by the photoresistor
Data Source
AI summary
A display panel includes a drive backplane, the drive backplane being provided with a binding layer for fixing a light-emitting chip, and the display panel further includes a photoresistor disposed on a surface of the drive backplane and arranged close to the binding layer, the photoresistor having a resistance for being increased when the light-emitting chip is in an abnormal state, and the binding layer being configured to be in a molten state under an action of heat generated by the photoresistor when the light-emitting chip is in the abnormal state. The technical solution of the present application can reduce the damage of the binding layer and ensure that the normal light-emitting chip can be effectively repaired and replaced.