Micro LED Bonding Layer Structure for Higher Light Extraction
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Solution Overview
Problem
Current micro LED technology faces challenges in improving light emission efficiency.
Innovation Solution
A micro LED structure is developed, featuring a bonding layer with a transparent bonding layer that is one fourth of a wavelength of light emitted, reducing metal absorption and increasing reflectivity, thereby enhancing light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal bonding layer is used to bond the N type semiconductor layer, then the bonding strength is improved, but the light absorption by metal increases and light emission efficiency deteriorates
Solution Approach 1:
The bonding layer is segmented into multiple functional layers: a first metal bonding layer for mechanical bonding strength, a transparent bonding layer for optical transparency, and a second metal bonding layer for electrical bonding. This segmentation allows each layer to perform its specific function without compromising the others.
Solution Approach 2:
The transparent bonding layer acts as an intermediary between the first and second metal bonding layers. It mediates the conflict between metal's high bonding strength and high light absorption by providing a transparent pathway for light while maintaining the bonding function through the metal layers.
2Loss of energy
If the transparent bonding layer thickness is optimized to one fourth of light wavelength, then reflectivity is improved and light emission efficiency increases, but manufacturing precision requirements increase
Solution Approach 1:
The thickness of the transparent bonding layer is optimized to a specific parameter value (one fourth of the light wavelength). This parameter optimization creates constructive interference that enhances reflectivity and light emission efficiency, transforming a potential manufacturing challenge into a performance advantage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed micro LED structure improves light emission efficiency by reducing metal absorption and increasing reflectivity, leading to better performance in micro LED display panels.
Implementation Method 1
A thickness of the transparent bonding layer is one fourth of a wavelength of light emitted by the light emitting layer
Implementation Method 2
A thickness of the transparent bonding layer is one fourth of a wavelength of light emitted by the light emitting layer
Data Source
AI summary
A micro LED includes a bonding layer; an N type semiconductor layer formed on the bonding layer; a light emitting layer formed on the N type semiconductor layer; and a P type semiconductor layer formed on the light emitting layer. The bonding layer includes: a first metal bonding layer; a second metal bonding layer bonded with the N type semiconductor layer; and a transparent bonding layer formed between the first metal bonding layer and the second metal bonding layer. A thickness of the transparent bonding layer is one fourth of a wavelength of light emitted by the light emitting layer.