Micro LED Bonding Layer Layout for Simpler Backplane Connection
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Solution Overview
Problem
The manufacturing process of micro LED display panels is complex due to the need for multiple bottom pads to connect micro LEDs with the IC backplane, which increases process difficulty and complexity.
Innovation Solution
A micro LED display panel design that includes a micro LED array area with a bonding layer formed between adjacent micro LED structures and at the bottom of these structures, which is bonded with a substrate, simplifying the manufacturing process by reducing the need for multiple pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple bottom pads are provided for connecting micro LEDs with the IC backplane, then the control and connection of micro LEDs is achieved, but the process complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple separate bottom pads into a single integrated bonding layer that bonds all micro LED structures to the substrate simultaneously. This consolidation reduces the number of discrete connection points from multiple pads to one unified bonding interface, thereby simplifying the manufacturing process while maintaining reliable electrical and mechanical connections for controlling all micro LEDs.
Solution Approach 2:
The bonding layer serves multiple functions simultaneously: it provides mechanical support, electrical connection, and thermal management for all micro LED structures. This multi-functional design replaces the need for multiple specialized pads, reducing process complexity while ensuring reliable control and connection of the micro LED array.
2Reliability
If multiple bottom pads are provided for connecting micro LEDs with the IC backplane, then the connection functionality is achieved, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple separate pad structures into a single bonding layer, reducing the number of manufacturing steps, materials required, and assembly operations. This consolidation directly lowers manufacturing costs while preserving the essential connection functionality between micro LEDs and the substrate.
Solution Approach 2:
The bonding layer performs multiple functions (mechanical support, electrical connection, thermal dissipation) in a single component, eliminating the need for multiple specialized pads. This multi-functionality reduces material costs, manufacturing complexity, and overall production expenses while maintaining full connection functionality.
Data Source
AI summary
A micro LED display panel includes a micro LED array area which includes a plurality of micro LED structures; a bonding layer formed between adjacent micro LED structures and at a bottom of the adjacent micro LED structures; and a substrate formed at a bottom of the bonding layer, wherein the bonding layer is bonded with the substrate.