Micro LED Bridge Structure for Reliable Electrode Connection
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Solution Overview
Problem
The challenge in miniaturizing and integrating light emitting diodes (LEDs) lies in achieving a reliable connection structure between the luminous bodies and electrodes or wirings, which is crucial for securing sufficient brightness while reducing size.
Innovation Solution
A light emitting diode device with a thin film transistor substrate featuring a first and second diode electrode, a passivation pattern, and bridge patterns that form a continuous sidewall with micro light emitting diodes, ensuring a reliable electrical connection through a cylindrical light emitting material with p-type and n-type semiconductor layers, and a method of manufacturing this structure using a single mask process with two etching steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If light emitting diodes are miniaturized and integrated, then the size of the device is reduced and brightness is improved, but the connection structure between luminous bodies and electrodes becomes less reliable
Solution Approach 1:
The connection structure is divided into multiple segments: bridge patterns connecting diode electrodes to micro light emitting diodes, and second bridge patterns connecting to anode/cathode electrodes. This segmented approach distributes the connection function across multiple reliable interfaces rather than relying on single large connections, thereby maintaining reliability while enabling miniaturization.
Solution Approach 2:
The bridge patterns and second bridge patterns extend in multiple dimensions to connect the micro light emitting diodes to the diode electrodes. By utilizing dimensional extension rather than just planar scaling, the connection structure maintains sufficient contact area and mechanical strength even as the overall device size is reduced.
2Reliability
If the connection structure is made more complex to improve reliability, then connection reliability improves, but the device complexity increases
Solution Approach 1:
Multiple functional elements are merged into integrated patterns: the bridge patterns and second bridge patterns are formed as continuous conductive structures that simultaneously provide electrical connection and structural support. The passivation layer is merged with the bridge pattern formation process, combining insulation and connection functions in an integrated manner that improves reliability without proportionally increasing complexity.
Solution Approach 2:
The bridge patterns serve multiple functions: they provide electrical connection between diode electrodes and micro light emitting diodes, act as structural support for the miniaturized components, and define the spatial arrangement of the integrated structure. This multi-functionality reduces the need for separate dedicated components, thereby improving reliability without excessive complexity increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust connection structure that enhances light efficiency and reduces the risk of bridge pattern breakage, enabling effective miniaturization and integration of LEDs.
Implementation Method 1
a light emitting diode is a device that converts an electrical signal into light, such as infrared light, visible light, etc., by using the characteristics of a compound semiconductor
Data Source
AI summary
A light emitting diode device includes a thin film transistor substrate having a plurality of light emitting areas, a first diode electrode and a second diode electrode on the thin film transistor substrate, a first passivation pattern between the first diode electrode and the second diode electrode, a plurality of micro light emitting diodes on the first passivation pattern, a first bridge pattern on the micro light emitting diodes and electrically connecting the first diode electrode to the micro light emitting diodes, and a second bridge pattern on the first bridge pattern and electrically connecting the second diode electrode to the micro light emitting diodes, wherein each sidewall of each of the micro light emitting diodes and each sidewall of the first passivation pattern form a same plane.