Micro-LED Bridge Support Structure for Higher Transfer Yield
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Solution Overview
Problem
Current micro-LED transfer methods face challenges in structural strength due to the small size of micro-LEDs, leading to fragile fixing structures and difficulties in maintaining the quality of micro-LEDs during transportation and transfer.
Innovation Solution
A micro light-emitting component with a support structure comprising a first dielectric layer and a second dielectric layer, where the first layer is silicon oxide and the second layer is silicon nitride, providing a bridge between the chip and the substrate, and a protrusion for additional support, which helps in stress regulation and structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the size of micro-LEDs is reduced, then the integration density is improved, but the structural strength of the fixing structure becomes fragile
Solution Approach 1:
The support structure is constructed from multiple dielectric layers (first dielectric layer, second dielectric layer, and third dielectric layer) with different mechanical properties. This composite structure provides enhanced structural strength and stress distribution, preventing the fragility that would result from simply scaling down the fixing structure dimensions to accommodate smaller micro-LEDs.
Solution Approach 2:
The invention extends the support structure in the vertical dimension by creating a multi-layer dielectric stack with varying thicknesses. The first dielectric layer has a first thickness, the second dielectric layer has a second thickness greater than the first, and the third dielectric layer has a third thickness greater than the second. This vertical dimensionality provides additional structural reinforcement without increasing the horizontal footprint, thereby maintaining high integration density while improving structural strength.
2Productivity
If a suspended structure is used to improve transfer yield, then the transfer process is improved, but the support structure becomes difficult to hold during transportation
Solution Approach 1:
The multi-layer dielectric composite structure provides both the suspended configuration needed for high transfer yield and the mechanical reinforcement required for transportation stability. The combination of layers with different thicknesses and material properties creates a structurally robust support that maintains the micro-LED in a suspended state during transfer while providing sufficient rigidity to prevent damage during subsequent handling and transportation.
Solution Approach 2:
The invention optimizes the thickness parameters of each dielectric layer to achieve the desired balance between suspended structure functionality and transportation stability. By carefully controlling the first thickness, second thickness (greater than first), and third thickness (greater than second), the support structure achieves the right combination of flexibility for transfer and rigidity for stable holding during transportation.
3Ease of manufacture
If a single-layer dielectric film is used for the fixing structure, then the manufacturing process is simple, but the structural strength becomes insufficient
Solution Approach 1:
The invention employs a multi-layer dielectric composite structure consisting of a first dielectric layer, a second dielectric layer, and a third dielectric layer, where each layer has different thickness characteristics. This composite approach significantly enhances the structural strength and mechanical properties of the fixing structure compared to a single-layer film, while still utilizing standard semiconductor fabrication processes for manufacturing.
Solution Approach 2:
Instead of increasing the horizontal dimensions or complexity of a single-layer structure, the invention adds vertical dimensionality through multiple dielectric layers with progressively increasing thicknesses. This multi-layer vertical stack provides the necessary structural strength while maintaining manufacturing simplicity by using conventional thin-film deposition techniques applied in sequence.
Data Source
AI summary
The disclosure relates to a micro light-emitting component, a display device and a manufacturing method thereof, including: at least one support structure, the support structure is composed of a dielectric layer and/or a semiconductor layer to form a bridge arm structure; a semiconductor layer sequence; the semiconductor layer sequence is directly or indirectly in contact and fixed with the substrate through the bridge arm, and the support structure further includes a protrusion extending from the substrate toward the support structure, and a distance between the protrusion and the support structure is 0 µm to 1 µm, thereby improving the transfer yield of the micro light-emitting component.