Micro LED Buffer Structure for Transfer Collision Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro light-emitting chips in micro LED display devices are prone to damage during handling and transfer due to collisions, which can lead to fabrication issues and reduced reliability.
Innovation Solution
A micro light-emitting component with a buffer element disposed on its outer sidewalls or surface, featuring an angle between the inner surface and the first surface of 90 degrees to 180 degrees, providing protection against collision damage and serving as a dam for quantum dot layers during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If micro light-emitting chips are handled and transferred during fabrication, then the display device can be assembled, but the chips are prone to collision damage
Solution Approach 1:
A buffer element is disposed on the micro light-emitting chip before handling and transfer operations. The buffer element has an inner surface and an outer surface, where the angle between the inner surface and the first surface of the chip is greater than or equal to 90 degrees and less than or equal to 180 degrees. This beforehand cushioning structure prevents collision damage to the chip during subsequent handling, transfer, and assembly operations.
2Reliability
If buffer element is added to protect chip, then chip damage is prevented, but device complexity increases
Solution Approach 1:
The buffer element serves multiple functions simultaneously: it protects the micro light-emitting chip from collision damage during handling and transfer, acts as a dam structure for quantum dot material deposition, and provides mechanical support during the assembly process. By integrating these multiple functions into a single component, the design avoids adding separate protective structures, thus minimizing the increase in device complexity while achieving comprehensive chip protection.
3Manufacturing precision
If buffer element is disposed on outer sidewalls or first surface, then bonding accuracy is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The buffer element is designed with specific geometric parameters: the angle between the inner surface and the first surface of the chip is controlled to be greater than or equal to 90 degrees and less than or equal to 180 degrees. This parameter range optimization ensures that the buffer element provides adequate protection while maintaining compatibility with standard manufacturing processes. The angle constraint balances the need for bonding accuracy with the ease of manufacturing, avoiding excessively tight tolerances that would complicate fabrication.
Data Source
AI summary
A micro light-emitting component, a micro light-emitting structure and a display device are disclosed. The micro light-emitting component has a micro light-emitting chip and a buffer element. The micro light-emitting chip has a first surface, a second surface opposite to the first surface and a plurality of outer sidewalls. The buffer element is disposed on the outer sidewalls or the first surface of the micro light-emitting chip. The buffer element has an inner surface and an outer surface. An angle is defined between the inner surface and the first surface or an extended surface of the first surface. The angle is greater than or equal to 90 degrees and less than or equal to 180 degrees. Therefore, the buffer element prevents the first surface of the micro light-emitting chip from damaging by collision when the micro light-emitting chip is dropped with the first surface facing down during a transferring procedure.