Micro LED Transfer Using Adhesive Bumps to Ease Alignment
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Solution Overview
Problem
The high manufacturing costs and limited efficiency and yield of transferring large amounts of micro light-emitting diodes (micro LEDs) hinder their commercialization, as conventional methods require precise alignment of carriers with micro LED arrays, leading to inefficiencies and reduced yield.
Innovation Solution
A transferring device and method utilizing a first substrate with adhesive regions and a transferring substrate with adhesive bumps, where the adhesive bumps have higher adhesiveness than the first adhesive regions, allowing for selective transfer of micro LEDs from the first substrate to the transferring substrate and subsequently to a driving back plate, improving efficiency and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional transferring methods using carriers are employed, then micro LED arrays can be transferred, but the manufacturing costs increase and the transferring efficiency and yield are limited due to strict alignment requirements
Solution Approach 1:
The patent introduces a transferring substrate with adhesive bumps as an intermediary carrier between the source substrate and the target substrate. This intermediary enables batch transfer of multiple micro LEDs simultaneously without requiring precise alignment of individual LEDs, thereby improving transferring efficiency and yield while reducing manufacturing costs compared to conventional one-by-one transfer methods
Solution Approach 2:
The patent combines multiple micro LEDs onto a single transferring substrate in one transfer operation. By merging the transfer of multiple LEDs into a single batch process using the transferring substrate with multiple adhesive bumps, the system achieves higher productivity and lower per-unit costs compared to conventional sequential transfer methods
2Productivity
If conventional transferring methods with carrier alignment are used, then micro LEDs can be transferred, but the transferring yield is reduced due to strict alignment control requirements
Solution Approach 1:
The patent changes the adhesive parameter by using adhesive bumps with controlled adhesiveness on the transferring substrate. This parameter change allows the micro LEDs to be selectively picked up and transferred without requiring precise alignment, as the adhesive bumps can accommodate position variations while maintaining reliable bonding, thereby improving transferring yield
Solution Approach 2:
The patent applies local quality by creating adhesive bumps with specific adhesiveness properties at specific locations on the transferring substrate. Each adhesive bump is designed to locally adhere to micro LEDs, providing targeted bonding capability that tolerates alignment variations and improves overall transferring yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the efficiency and yield of transferring micro LEDs by leveraging the adhesiveness difference between the adhesive regions, enabling the selective transfer of a large number of micro LEDs while maintaining accuracy, thus overcoming the limitations of conventional methods.
Implementation Method 1
A surface of each adhesive bump away from the transferring substrate has the property of viscosity and is capable of being adhered to at least part of the plurality of micro light emitting diodes
Data Source
AI summary
The present application provides a method for transferring micro light emitting diodes and a transferring device. The device includes: a first substrate, having at least one surface arranged with a plurality of first adhesive region for a plurality of micro light emitting diodes to adhere thereon; and a transferring substrate, having at least one surface arranged with a plurality of second adhesive regions for at least a portion of the micro light emitting diodes to adhere on and being configured to transfer the at least a portion of the micro light emitting diodes to a driving back plate.