Micro LED Packaging Layout With Carrier-Based Array Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The micro LED display technology faces challenges in accurately transferring and aligning micro LEDs due to machine movement errors and alignment issues in the transfer printing process, leading to potential operational failures if the LEDs are not correctly placed.
Innovation Solution
A manufacturing method involving a series of steps including forming transparent packaging structures, a molding layer, and redistribution structures on a carrier plate, followed by electrical connections to a circuit substrate, which ensures precise placement and connection of micro LEDs, enhancing the accuracy and efficiency of the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical transfer printing is used to transfer micro LEDs, then large-scale production is enabled, but machine movement errors and alignment accuracy deteriorate
Solution Approach 1:
The patent introduces a carrier substrate as an intermediary platform that pre-arranges multiple micro LEDs in their final positions before transfer. This mediator absorbs the alignment complexity, allowing mechanical transfer to focus only on picking and placing entire groups of LEDs rather than individually positioning each one, thus maintaining high precision while enabling mass production
Solution Approach 2:
The patent performs preliminary arrangement of micro LEDs on the carrier substrate before the actual transfer process. By pre-positioning LEDs on the carrier with precise spacing and alignment features, the complex alignment task is completed in advance, and the mechanical transfer system only needs to execute simple pick-and-place operations, thereby ensuring positioning accuracy at scale
2Manufacturing precision
If individual micro LED placement is performed, then positioning precision is maintained, but transfer efficiency and productivity decrease
Solution Approach 1:
The patent merges multiple individual LED placement operations into a single group transfer operation. By arranging multiple micro LEDs together on a carrier substrate with shared alignment features, the system transfers them as a unified group, reducing the number of mechanical operations from N individual placements to 1 group transfer, thus dramatically improving efficiency while maintaining precision through the carrier's alignment structure
3Object-affected harmful factors
If transparent packaging structures are formed around each LED, then light leakage and crosstalk are reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the formation of multiple individual packaging structures into a single batch processing step. By designing the packaging layer to be formed simultaneously over multiple LEDs on the carrier substrate using techniques like spin coating or dip coating, the system creates individual transparent encapsulation for each LED while performing the operation once for the entire array, thus reducing light leakage without proportionally increasing manufacturing complexity
Data Source
AI summary
A display device includes a circuit substrate and at least one light emitting diode (LED) packaging structure electrically connected to the circuit substrate. Each of the at least one LED packaging structure includes a plurality of LEDs, a plurality of transparent packaging structures, a molding layer, a redistribution structure and a common electrode. Each LED includes a first electrode, a semiconductor stack structure and a second electrode stacked with each other. The transparent packaging structures respectively surround the LEDs. The molding layer surrounds the transparent packaging structures. The redistribution structure is located on a first side of the molding layer and is electrically connected to the first electrodes of the LEDs. The common electrode is located on a second side of the molding layer and is electrically connected to the second electrodes of the LEDs.