Micro LED Carrier Board Warpage Reduction via Patterned Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro LED displays face damage and reduced reliability during the mass transfer process due to warpage and bending of the substrate, leading to decreased yield and durability.
Innovation Solution
A micro LED carrier board with a patterned structure on its substrate, featuring varying trench densities and thicknesses in central and peripheral regions, which reduces warpage and applies balanced pressure to minimize damage during the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a mass transfer process is performed for micro LED display manufacture, then productivity is improved, but the micro light-emitting diode elements may be damaged or destroyed
Solution Approach 1:
The patent applies local quality by creating a non-uniform pressure distribution across the substrate surface during the transfer process. The pressure is higher at the center region and lower at the peripheral regions, which prevents uniform warpage and reduces stress concentration on micro LED elements. This localized pressure control allows mass transfer while protecting element integrity.
Solution Approach 2:
The patent changes the pressure parameter spatially across the substrate surface. By varying pressure from center to peripheral regions, the system optimizes the transfer process to prevent substrate warpage and element damage. This parameter variation enables both high productivity and element protection.
2Ease of operation
If uniform pressure is applied during transfer, then ease of operation is improved, but substrate warpage increases causing element damage
Solution Approach 1:
Instead of uniform pressure, the patent implements local quality by applying differentiated pressure to different regions of the substrate. The center region receives higher pressure while peripheral regions receive lower pressure, which compensates for warpage effects and maintains substrate flatness during transfer.
Solution Approach 2:
The patent applies preliminary anti-action by pre-compensating for expected substrate warpage through non-uniform pressure distribution. The pressure profile is designed in advance to counteract the warpage tendency, preventing element damage before it occurs during the transfer process.
Data Source
AI summary
A micro LED carrier board is provided. The micro LED carrier board includes a substrate structure having a first surface and a second surface and having a central region and a peripheral region on the outside of the central region. The micro LED carrier board includes a plurality of micro LED elements forming an array and on the second surface of the substrate structure. The micro LED carrier board includes a patterned structure formed on the first surface and the second surface. The patterned structure has a first pattern density in the central region and a second pattern density in the peripheral region, and the first pattern density is different from the second pattern density.