Micro-LED Chip Layout for Edge Isolation and Carrier Efficiency
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Solution Overview
Problem
Existing micro-LED structures face challenges in enhancing light emission efficiency due to surface recombination carrier loss at the edges of the light emitting layer contacting the conductive layers.
Innovation Solution
A micro-LED structure is designed with a light emitting layer that extends horizontally away from the edges of the first and second conductive layers, preventing edge contact and reducing surface recombination, while also incorporating a metal layer on the light emitting layer between adjacent micro-LEDs for improved isolation and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the light emitting layer contacts the edges of the conductive layers, then the device structure is simplified, but surface recombination carrier loss increases and light emission efficiency decreases
Solution Approach 1:
The light emitting layer is extended in the horizontal dimension away from the conductive layer edges, creating a spatial separation that prevents edge contact. This dimensional extension resolves the contradiction by allowing structural simplicity while eliminating surface recombination losses through increased horizontal spacing.
2Loss of energy
If the light emitting layer extends horizontally away from the conductive layer edges, then light emission efficiency is improved, but the device area increases
Solution Approach 1:
The light emitting layer is selectively extended only in the horizontal regions adjacent to the conductive layer edges, while maintaining compact dimensions in other areas. This localized extension improves light emission efficiency by preventing edge contact without proportionally increasing the overall device area.
3Area of stationary object
If adjacent micro-LEDs are placed close together, then the chip area is reduced, but carrier injection efficiency decreases due to interference between adjacent devices
Solution Approach 1:
A metal layer is introduced as an intermediary element positioned between adjacent micro-LEDs. This metal layer acts as a barrier that prevents harmful carrier injection interference between neighboring devices while allowing the micro-LEDs to be placed closer together, thus reducing chip area without sacrificing carrier injection efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light emission efficiency by minimizing surface recombination and improving carrier injection efficiency, while the metal layer aids in isolating adjacent micro-LEDs, thereby boosting overall performance.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED structure includes a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer extends along a horizontal level away from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer. A profile of the first type conductive layer perpendicularly projected on a bottom surface of the second type conductive layer is surrounded by the bottom edge of the second type conductive layer.