Micro LED Conductive Layer Layout for High-Resolution Yield
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional micro LED display devices face challenges in achieving high resolution and manufacturing yield due to the low manufacturing process tolerance of metal grids in high-resolution applications, such as UHD and AR/VR displays.
Innovation Solution
A micro LED display device configuration that uses a thicker metal conductive layer instead of a conventional metal grid to electrically connect micro LED units to the driving substrate, improving lighting efficiency and reducing power consumption, while maintaining uniform brightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal grid is used to electrically connect the semiconductor layer of micro LEDs to the driving substrate, then uniform brightness and reduced power consumption are achieved, but the manufacturing process tolerance is low and manufacturing yield decreases in high-resolution applications
Solution Approach 1:
The patent changes the thickness parameter of the conductive layer from a thin metal grid structure to a thick conductive layer (greater than the epitaxial structure layer thickness). This parameter change improves manufacturing tolerance and yield while maintaining the electrical connection function and achieving uniform brightness distribution across the micro LED array.
Solution Approach 2:
The patent employs a composite structure where a thick conductive layer is combined with a light conversion layer to form an integrated functional layer. This composite approach allows the conductive layer to serve dual purposes: electrical connection and structural stability, while the light conversion layer handles optical functions, thereby improving overall manufacturing robustness without sacrificing performance.
2Reliability
If a metal grid is used to electrically connect the semiconductor layer of micro LEDs to the driving substrate, then electrical connection is established, but power consumption is not optimized
Solution Approach 1:
The patent changes the thickness parameter of the conductive layer to be greater than the epitaxial structure layer thickness. This parameter optimization reduces electrical resistance and improves current distribution uniformity across the micro LED array, thereby reducing power consumption while maintaining reliable electrical connection.
3Reliability
If a metal grid is used to electrically connect the semiconductor layer of micro LEDs to the driving substrate, then connection is achieved, but lighting efficiency is reduced
Solution Approach 1:
The patent optimizes the thickness parameter of the conductive layer to be greater than the epitaxial structure layer thickness. This reduces electrical resistance and minimizes energy loss in the form of heat, thereby improving lighting efficiency while maintaining reliable electrical connection to the micro LED units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the manufacturing yield and meets the requirements of high-resolution displays by improving lighting efficiency and reducing power consumption, addressing the limitations of conventional metal grid connections.
Implementation Method 1
The light conversion layer is disposed in a part of the light conversion regions and is configured to convert wavelengths of lights emitted from the corresponding micro LED units
Data Source
AI summary
A micro LED display device includes a circuit substrate, an epitaxial structure layer, a metal conductive layer, a light conversion layer and a light-shielding structure. The epitaxial structure layer includes a first surface, a second surface, and a plurality of micro LED units separated from each other. The micro LED units are electrically connected to the circuit substrate. The metal conductive layer is disposed on the second surface and directly contacts the epitaxial structure layer, and has a plurality of light conversion region each corresponds to one of the micro LED units. The light conversion layer is disposed in a part of the light conversion regions. The light-shielding structure does not cover the light conversion regions. In the direction perpendicular to a bonding surface of the circuit substrate, the thickness of the metal conductive layer is greater than that of the epitaxial structure layer.