Micro LED Package Structure for Contrast and Reflection Control
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Solution Overview
Problem
LED displays face issues with high reflection of extraneous light causing reduced contrast ratios and false lighting, despite offering higher luminance than backlight-type liquid-crystal displays.
Innovation Solution
A light emitting diode package comprising a substrate with micro LED chips, a black material layer, a transparent material layer, and a pixel controller, designed to enhance contrast ratio and reduce side emissions by optimizing the ratio of substrate width to transparent material layer thickness and incorporating a black material layer to minimize extraneous light reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If LED displays use standard packaging structure, then manufacturing is simple, but extraneous light reflection causes reduced contrast ratios and false lighting
Solution Approach 1:
The patent introduces a black material layer as an intermediary between the substrate and the transparent material layer. This black material layer specifically targets and absorbs extraneous light that would otherwise reflect off the substrate, preventing false lighting and improving contrast ratio without fundamentally changing the overall package structure
Solution Approach 2:
The patent applies the black material layer selectively in specific regions where extraneous light reflection occurs, rather than changing the entire package structure. This localized approach targets the harmful reflection issue while maintaining simplicity in other areas of the package design
2Object-affected harmful factors
If transparent material layer thickness is increased, then protection is improved, but side emissions increase and contrast ratio decreases
Solution Approach 1:
The patent optimizes the thickness parameter of the transparent material layer to a specific range that balances protection and light emission control. By carefully selecting this parameter, the design achieves adequate protection while minimizing side emissions that would reduce contrast ratio
Solution Approach 2:
The patent combines the optimized transparent material layer thickness with the black material layer in specific regions to locally control light behavior. This allows different parts of the package to have different optical properties - the black material layer absorbs extraneous light while the transparent layer provides protection with controlled thickness
3Manufacturing precision
If micro LED chip size is reduced, then display resolution is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses micro LED chips that are segmented into small individual units, each with precise size control. This segmentation allows for high-resolution displays while the standardized micro chip design facilitates consistent manufacturing across multiple chips
Solution Approach 2:
The patent specifies precise dimensional parameters for micro LED chips, including width and thickness ranges. By controlling these parameters within defined ranges, the design achieves high display resolution while maintaining manufacturability through standardized production processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher luminance and contrast ratios by reducing side emissions and minimizing extraneous light reflection, thereby improving the performance of LED displays.
Implementation Method 1
a first semiconductor layer with a light emitting surface exposed outside and the light emitting surface has a rough texture
Implementation Method 2
The black material layer covers the top surface of the substrate to expose the plurality of micro LED chips
Data Source
AI summary
A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.